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ZHCSNW6G december 2003 – march 2023 LM2901-Q1 , LM2901AV-Q1 , LM2901B-Q1 , LM2901V-Q1

PRODMIX

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

D|14
PW|14

散热焊盘机械数据 (封装 | 引脚)

订购信息

6.8 Thermal Information for LM2901x-Q1

THERMAL METRIC⁽¹⁾		LM2901x-Q1		UNIT
		D (SOIC)	PW (TSSOP)
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance⁽²⁾	88.6	119.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	49.1	47.9	°C/W
R_θJB	Junction-to-board thermal resistance	43.0	60.9	°C/W
ψ_JT	Junction-to-top characterization parameter	13.6	5.4	°C/W
ψ_JB	Junction-to-board characterization parameter	42.7	60.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semicondctor and IC Package Thermal Metrics application report, SPRA953.

(2) Maximum power dissipation is a function of T_J(max), R_θJA, and T_A. The maximum allowable power dissipation at any allowable ambient temperature is P_D = (T_J(max) − T_A) / R_θJA. Operating at the absolute maximum T_J of 150°C can affect reliability.