SNVS011H June   1999  – September 2015 LM3480

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM3480-3.3, LM3480-5
    6. 6.6 Electrical Characteristics: LM3480-12, LM3480-15
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 3.3-V, 5-V, 12-V, and 15-V Versions Available
      2. 7.3.2 1.2-V Ensured Maximum Dropout
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VIN = 5 V
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Capacitors
          1. 8.2.2.1.1 Output Capacitor
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from G Revision (February 2015) to H Revision

  • Replaced Functional Block DiagramGo
  • Changed text of External Capacitors subsection Go
  • Changed text of Output Capacitor subsection Go

Changes from F Revision (December 2014) to G Revision

  • Changed pin numbers indicated in Typical Application drawing; fix typosGo
  • Deleted soldering specs - found in POAGo
  • Changed Handling Ratings to ESD Ratings format Go

Changes from E Revision (March 2013) to F Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; add updated Thermal InformationGo

Changes from D Revision (March 2013) to E Revision

  • Changed layout of National Data Sheet to TI formatGo
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