SNVS565I November   2008  – August 2015 LM5085 , LM5085-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM5085
    3. 6.3 ESD Ratings: LM5085-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Regulation Control Circuit
      2. 7.3.2  On-Time Timer
      3. 7.3.3  Shutdown
      4. 7.3.4  Current Limiting
      5. 7.3.5  Current Limit Off-Time
      6. 7.3.6  VCC Regulator
      7. 7.3.7  PGATE Driver Output
      8. 7.3.8  P-Channel MOSFET Selection
      9. 7.3.9  Soft-Start
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Standby Mode with VIN <4.5 V
      2. 7.4.2 RT Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Components
        2. 8.2.2.2 Alternate Output Ripple Configurations
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NGQ|8
  • DGK|8
  • DGN|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from H Revision (October 2014) to I Revision

Changes from G Revision (March 2013) to H Revision

  • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from F Revision (March 2013) to G Revision

  • Changed layout of National Data Sheet to TI formatGo
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