ZHCSPC5 October   2022 LM51231-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Enable/Disable (EN, VH Pin)
      2. 7.3.2  High Voltage VCC Regulator (BIAS, VCC Pin)
      3. 7.3.3  Light Load Switching Mode Selection (MODE Pin)
      4. 7.3.4  VOUT Range Selection (RANGE Pin)
      5. 7.3.5  Line Undervoltage Lockout (UVLO Pin)
      6. 7.3.6  Fast Restart using VCC HOLD (VH Pin)
      7. 7.3.7  Adjustable Output Regulation Target (VOUT, TRK, VREF Pin)
      8. 7.3.8  Overvoltage Protection (VOUT Pin)
      9. 7.3.9  Power Good Indicator (PGOOD Pin)
      10. 7.3.10 Dynamically Programmable Switching Frequency (RT)
      11. 7.3.11 External Clock Synchronization (SYNC Pin)
      12. 7.3.12 Programmable Spread Spectrum (DITHER Pin)
      13. 7.3.13 Programmable Soft-start (SS Pin)
      14. 7.3.14 Wide Bandwidth Transconductance Error Amplifier and PWM (TRK, COMP Pin)
      15. 7.3.15 Current Sensing and Slope Compensation (CSP, CSN Pin)
      16. 7.3.16 Constant Peak Current Limit (CSP, CSN Pin)
      17. 7.3.17 Maximum Duty Cycle and Minimum Controllable On-time Limits
      18. 7.3.18 MOSFET Drivers, Integrated Boot Diode, and Hiccup Mode Fault Protection (LO, HO, HB Pin)
      19. 7.3.19 Thermal Shutdown Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Status
        1. 7.4.1.1 Shutdown Mode
        2. 7.4.1.2 Configuration Mode
        3. 7.4.1.3 Active Mode
        4. 7.4.1.4 Bypass Mode
          1. 7.4.1.4.1 Bypass DE mode
          2. 7.4.1.4.2 Bypass FPWM
      2. 7.4.2 Light Load Switching Mode
        1. 7.4.2.1 Forced PWM (FPWM) Mode
        2. 7.4.2.2 Diode Emulation (DE) Mode
        3. 7.4.2.3 Forced Diode Emulation Operation in FPWM Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Ideas
      4. 8.2.4 Application Curves
    3. 8.3 System Example
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) LM5123-Q1 UNIT
RGR(QFN)
20 PINS
RqJA Junction-to-ambient thermal resistance 43.3 °C/W
RqJC(top) Junction-to-case (top) thermal resistance 39.9 °C/W
RqJB Junction-to-board thermal resistance 17.8 °C/W
yJT Junction-to-top characterization parameter 0.8 °C/W
yJB Junction-to-board characterization parameter 17.8 °C/W
RqJC(bot) Junction-to-case (bottom) thermal resistance 5.3 °C/W
(1) For more information about traditional and new thermal metrics, see the application report.
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