The following list is in order of importance starting with the most important item:-

• Place high frequency input bypass capacitor, Cinhf, as close to the LM53600-Q1 and LM53601-Q1 devices as possible.
• Connect AGND and GND to the DAP immediately adjacent to the LM53600-Q1 and LM53601-Q1 devices.
• Do not interrupt the ground plain under the loop containing the VIN and GND pins and Cinhf of the LM53600-Q1 and LM53601-Q1 devices.
• The boot capacitor, CBOOT, should be close to the LM53601-Q1 and the loop from the SW pin, through the boot capacitor and into the BOOT pin should be kept as small as possible.
• Keep the SW node as small as possible. It should be wide enough to carry the converter’s full current without significant drop.
• 4.7 µF of bypassing should be close to the input of the LM53600-Q1 and LM53601-Q1 devices.
• Place CVCC, the VCC pin’s bypass, and CBIAS, the bypass for FB for fixed voltage devices and BIAS for adjustable devices as close to the LM53600-Q1 and LM53601-Q1 devices as possible.
• The first output the trace from the output inductor to the output node should run by an output capacitor before joining the rest of the output node.
• Keep 10 µF close to the output (output inductor and GND) of the LM53600-Q1 and LM53601-Q1 devices.
• Clear the layer beneath the SW node.

Figure 11-1 Current Loops with Fast Transients