Large QFN packages can experience high solder-joint stress. TI recommends several best practices to ensure solder-joint reliability. First, the instructions for the NC1 and NC2 anchor pins found in Table 4-1 must be followed. Second, all the LMG3522R030-Q1 board solder pads must be non-solder-mask defined (NSMD) as shown in the land pattern example in Mechanical, Packaging, and Orderable Information. Finally, any board trace connected to an NSMD pad must be less than 2/3 the width of the pad on the pad side where it is connected. The trace must maintain this 2/3 width limit for as long as it is not covered by solder mask. After the trace is under solder mask, there are no limits on the trace dimensions. All these recommendations are followed in the Layout Example.