SNOSB18I April   2010  – December 2014 LMH6629

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics 5V
    6. 6.6 Electrical Characteristics 3.3V
    7. 6.7 Typical Performance Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 WSON-8 Control Pins and SOT-23-5 Comparison
      2. 7.3.2 Compensation
      3. 7.3.3 Cancellation of Offset Errors Due to Input Bias Currents
      4. 7.3.4 Total Input Noise vs. Source Resistance
      5. 7.3.5 Noise Figure
      6. 7.3.6 Single-Supply Operation
      7. 7.3.7 Low-Noise Transimpedance Amplifier
      8. 7.3.8 Low-Noise Integrator
      9. 7.3.9 High-Gain Sallen-Key Active Filters
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Low-Noise Magnetic Media Equalizer
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from H Revision (October 2014) to I Revision

  • Updated ESD Ratings table. Go
  • Revised paragraph beginning with "The optimum value of "CF in the Low-Noise Transimpedance Amplifier sectionGo
  • Updated Related Documentation sectionGo

Changes from G Revision (March 2013) to H Revision

  • Added, updated, or renamed the following sections: Device Information Table, Pin Configuration and Functions, Application and Implementation; Power Supply Recommendations; Layout; Device and Documentation Support; Mechanical, Packaging, and Ordering InformationGo

Changes from F Revision (March 2013) to G Revision

  • Changed layout of National Data Sheet to TI formatGo
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