ZHCSPF6B february   2022  – may 2023 LMQ66410 , LMQ66420 , LMQ66430

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 System Characteristics
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Enable, Start-Up, and Shutdown
      2. 8.3.2  Adjustable Switching Frequency (with RT)
      3. 8.3.3  Power-Good Output Operation
      4. 8.3.4  Internal LDO, VCC, and VOUT/FB Input
      5. 8.3.5  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      6. 8.3.6  Output Voltage Selection
      7. 8.3.7  Spread Spectrum
      8. 8.3.8  Soft Start and Recovery from Dropout
        1. 8.3.8.1 Recovery from Dropout
      9. 8.3.9  Current Limit and Short Circuit
      10. 8.3.10 Thermal Shutdown
      11. 8.3.11 Input Supply Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
        1. 8.4.3.1 CCM Mode
        2. 8.4.3.2 Auto Mode – Light Load Operation
          1. 8.4.3.2.1 Diode Emulation
          2. 8.4.3.2.2 Frequency Reduction
        3. 8.4.3.3 FPWM Mode – Light Load Operation
        4. 8.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 8.4.3.5 Dropout
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Synchronous Buck Regulator at 400 kHz
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1  Choosing the Switching Frequency
        2. 9.2.3.2  Setting the Output Voltage
          1. 9.2.3.2.1 VOUT / FB for Adjustable Output
        3. 9.2.3.3  Inductor Selection
        4. 9.2.3.4  Output Capacitor Selection
        5. 9.2.3.5  Input Capacitor Selection
        6. 9.2.3.6  CBOOT
        7. 9.2.3.7  VCC
        8. 9.2.3.8  CFF Selection
        9. 9.2.3.9  External UVLO
        10. 9.2.3.10 Maximum Ambient Temperature
      4. 9.2.4 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
        1. 9.5.1.1 Ground and Thermal Considerations
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方米6体育平台手机版_好二三四免责声明
      2. 10.1.2 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.
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