ZHCSM75U August 1999 – October 2020 LMV331 , LMV339 , LMV393
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | LMV339 | LMV393 | LMV331 | UNIT | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| D | PW | RUC | D | DDU | DGK | PW | DBV | DCK | |||
| 14 PINS | 8 PINS | 5 PINS | |||||||||
| RθJA | Junction-to-ambient thermal resistance | 86 | 113 | 216 | 97 | 210 | 172 | 149 | 206 | 252 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | — | — | 51.3 | — | — | — | — | — | — | |
| RθJB | Junction-to-board thermal resistance | — | — | 59.0 | — | — | — | — | — | — | |
| ψJT | Junction-to-top characterization parameter | — | — | 1.2 | — | — | — | — | — | — | |
| ψJB | Junction-to-board characterization parameter | — | — | 59.0 | — | — | — | — | — | — | |