SNVS345G June   2006  – December 2014 LP5951

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Enable Control Characteristics
    7. 6.7 Transient Characteristics
    8. 6.8 Output Capacitor, Recommended Specification
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 No-Load Stability
      2. 7.3.2 Enable Operation
      3. 7.3.3 Fast Turn Off And On
      4. 7.3.4 Short-Circuit Protection
      5. 7.3.5 Thermal-Overload Protection
      6. 7.3.6 Reverse Current Path
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power Dissipation And Device Operation
        2. 8.2.2.2 External Capacitors
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 Capacitor Characteristics
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
    1. 9.1 Output Current Derating
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from F Revision (May 2013) to G Revision

  • Added Device Information and ESD Rating tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sections; updated pin names; added new thermal information; moved some curves to Application Curves sectionGo
  • Changed wording of footnote 2 Go
  • Changed values of RθJA and "454 mW" to "511 mW" for SOT-23-5 package Go

Changes from E Revision (April 2013) to F Revision

  • Changed layout of National Data Sheet to TI formatGo