ZHCSIT2F September   2010  – September 2018 MSP430F5304 , MSP430F5308 , MSP430F5309 , MSP430F5310

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6  Thermal Resistance Characteristics
    7. 5.7  Schmitt-Trigger Inputs – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RST/NMI)
    8. 5.8  Inputs – Ports P1 and P2 (P1.0 to P1.7, P2.0 to P2.7)
    9. 5.9  Leakage Current – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7) (P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RST/NMI)
    10. 5.10 Outputs – General-Purpose I/O (Full Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    11. 5.11 Outputs – General-Purpose I/O (Reduced Drive Strength) (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    12. 5.12 Output Frequency – General-Purpose I/O (P1.0 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
    13. 5.13 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
    14. 5.14 Crystal Oscillator, XT1, Low-Frequency Mode
    15. 5.15 Crystal Oscillator, XT2
    16. 5.16 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
    17. 5.17 Internal Reference, Low-Frequency Oscillator (REFO)
    18. 5.18 DCO Frequency
    19. 5.19 PMM, Brownout Reset (BOR)
    20. 5.20 PMM, Core Voltage
    21. 5.21 PMM, SVS High Side
    22. 5.22 PMM, SVM High Side
    23. 5.23 PMM, SVS Low Side
    24. 5.24 PMM, SVM Low Side
    25. 5.25 Wake-up Times From Low-Power Modes and Reset
    26. 5.26 Timer_A
    27. 5.27 Timer_B
    28. 5.28 USCI (UART Mode) Clock Frequency
    29. 5.29 USCI (UART Mode)
    30. 5.30 USCI (SPI Master Mode) Clock Frequency
    31. 5.31 USCI (SPI Master Mode)
    32. 5.32 USCI (SPI Slave Mode)
    33. 5.33 USCI (I2C Mode)
    34. 5.34 10-Bit ADC, Power Supply and Input Range Conditions
    35. 5.35 10-Bit ADC, Timing Parameters
    36. 5.36 10-Bit ADC, Linearity Parameters
    37. 5.37 REF, External Reference
    38. 5.38 REF, Built-In Reference
    39. 5.39 Comparator_B
    40. 5.40 Ports PU.0 and PU.1
    41. 5.41 LDO-PWR (LDO Power System)
    42. 5.42 Flash Memory
    43. 5.43 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  CPU (Link to User's Guide)
    2. 6.2  Operating Modes
    3. 6.3  Interrupt Vector Addresses
    4. 6.4  Memory Organization
    5. 6.5  Bootloader (BSL)
    6. 6.6  JTAG Operation
      1. 6.6.1 JTAG Standard Interface
      2. 6.6.2 Spy-Bi-Wire Interface
    7. 6.7  Flash Memory (Link to User's Guide)
    8. 6.8  RAM (Link to User's Guide)
    9. 6.9  Peripherals
      1. 6.9.1  Digital I/O (Link to User's Guide)
      2. 6.9.2  Port Mapping Controller (Link to User's Guide)
      3. 6.9.3  Oscillator and System Clock (Link to User's Guide)
      4. 6.9.4  Power-Management Module (PMM) (Link to User's Guide)
      5. 6.9.5  Hardware Multiplier (Link to User's Guide)
      6. 6.9.6  Real-Time Clock (RTC_A) (Link to User's Guide)
      7. 6.9.7  Watchdog Timer (WDT_A) (Link to User's Guide)
      8. 6.9.8  System Module (SYS) (Link to User's Guide)
      9. 6.9.9  DMA Controller (Link to User's Guide)
      10. 6.9.10 Universal Serial Communication Interface (USCI) (Links to User's Guide: UART Mode, SPI Mode, I2C Mode)
      11. 6.9.11 TA0 (Link to User's Guide)
      12. 6.9.12 TA1 (Link to User's Guide)
      13. 6.9.13 TA2 (Link to User's Guide)
      14. 6.9.14 TB0 (Link to User's Guide)
      15. 6.9.15 Comparator_B (Link to User's Guide)
      16. 6.9.16 ADC10_A (Link to User's Guide)
      17. 6.9.17 CRC16 (Link to User's Guide)
      18. 6.9.18 Reference (REF) Module Voltage Reference (Link to User's Guide)
      19. 6.9.19 LDO and Port U
      20. 6.9.20 Embedded Emulation Module (EEM) (S Version) (Link to User's Guide)
    10. 6.10 Peripheral File Map
    11. 6.11 Input/Output Diagrams
      1. 6.11.1  Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
      2. 6.11.2  Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
      3. 6.11.3  Port P3 (P3.0 to P3.4) Input/Output With Schmitt Trigger
      4. 6.11.4  Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
      5. 6.11.5  Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
      6. 6.11.6  Port P5 (P5.2) Input/Output With Schmitt Trigger
      7. 6.11.7  Port P5 (P5.3) Input/Output With Schmitt Trigger
      8. 6.11.8  Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
      9. 6.11.9  Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      10. 6.11.10 Port U (PU.0 and PU.1) Input/Output
      11. 6.11.11 Port J (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      12. 6.11.12 Port J (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    12. 6.12 Device Descriptors
  7. 7器件和文档支持
    1. 7.1 入门和后续步骤
    2. 7.2 Device Nomenclature
    3. 7.3 工具与软件
    4. 7.4 文档支持
    5. 7.5 相关链接
    6. 7.6 社区资源
    7. 7.7 商标
    8. 7.8 静电放电警告
    9. 7.9 Glossary
  8. 8机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

2 修订历史记录

Changes from November 23, 2013 to September 25, 2018

  • 通篇更改了文档格式，其中包括更改结构并添加章节编号Go
  • 添加了器件信息 表Go
  • 添加了Section 1.4并将所有功能方框图移到这里Go
  • 更改了Figure 1-2 中 USCI 模块的数量并添加了注释Go
  • 将Figure 1-3 中的 USCI0 更改成了 USCI1Go
  • Added Section 3, Device Comparison, and moved Table 3-1, Family Members, to itGo
  • In Table 3-1, changed the number of USCI modules in the 48-pin packages from 1 to 2 and added note about limitations on simultaneous useGo
  • Added Section 3.1, Related ProductsGo
  • Changed the title of Table 4-1 from Terminal Functions to Signal DescriptionsGo
  • Added "with port interrupt" to P2.7 description in Table 4-1, Signal DescriptionsGo
  • Added "Port U is supplied by the LDOO rail" to the PU.0 and PU.1 descriptions in Table 4-1, Signal DescriptionsGo
  • Added typical conditions statements at the beginning of Section 5, SpecificationsGo
  • Added Section 5 and moved all electrical specifications to itGo
  • Added Section 5.2, ESD RatingsGo
  • Moved Section 5.6, Thermal Resistance CharacteristicsGo
  • Changed the TYP value of the CL,eff parameter with Test Conditions of "XTS = 0, XCAPx = 0" from 2 pF to 1 pF in Section 5.14, Crystal Oscillator, XT1, Low-Frequency ModeGo
  • Changed the MIN value of the V(DVCC_BOR_hys) parameter from 60 mV to 50 mV in Section 5.19, PMM, Brownout Reset (BOR)Go
  • Updated notes (1) and (2) and added note (3) in Section 5.25, Wake-up Times From Low-Power Modes and ResetGo
  • Changed (corrected) the port pins muxed with ADC10 pins in V(Ax) Test Conditions in Section 5.34, 10-Bit ADC, Power Supply and Input Range ConditionsGo
  • Removed ADC10DIV from the formula for the TYP value in the second row of the tCONVERT parameter in Section 5.35, 10-Bit ADC, Timing Parameters, because ADC10CLK is after divisionGo
  • Updated Test Conditions for all parameters in Section 5.36, 10-Bit ADC, Linearity Parameters: changed from "CVREF+ = 20 pF" to "CVeREF+ = 20 pF"; changed from "(VeREF+ – VeREF–)min ≤ (VeREF+ – VeREF–)" to "1.4 V ≤ (VeREF+ – VeREF–)"Go
  • Added "CVeREF+ = 20 pF" to EI Test Conditions in Section 5.36, 10-Bit ADC, Linearity ParametersGo
  • Added "ADC10SREFx = 11b" to Test Conditions for EG and ET in Section 5.36, 10-Bit ADC, Linearity ParametersGo
  • Changed the MIN value of AVCC(min) with Test Conditions of "REFVSEL = {0} for 1.5 V" from 2.2 V to 1.8 V in Section 5.38, REF, Built-In ReferenceGo
  • Changed the value of CBREFACC in both Test Conditions for the IAVCC_REF parameter (changed first row from 0 to 1; changed second row from 1 to 0) in Section 5.39, Comparator_BGo
  • Changed the MAX value of the tEN_CMP parameter with Test Conditions of "CBPWRMD = 10" from 1.5 µs to 100 µs in Section 5.39, Comparator_BGo
  • Changed the note that starts "Tools that access the Spy-Bi-Wire and BSL interfaces..."Go
  • Throughout document, changed all instances of "bootstrap loader" to "bootloader"Go
  • Corrected spelling of NMIIFG in Table 6-8, System Module Interrupt Vector RegistersGo
  • Changed Figure 6-8, Port P5 (P5.3) Diagram, (added P5SEL.2 and XT2BYPASS inputs with AND and OR gates)Go
  • Changed P5SEL.3 column from X to 0 for "P5.3 (I/O)" rows in Table 6-48, Port P5 (P5.2 and P5.3) Pin FunctionsGo
  • Changed Figure 6-10, Port P5 (P5.5) Diagram, (added P5SEL.5 input and OR gate)Go
  • Changed P5SEL.5 column from X to 0 for "P5.5 (I/O)" rows in Table 6-49, Port P5 (P5.4 and P5.5) Pin FunctionsGo
  • Changed Table 6-51, Port PU.0, PU.1 FunctionsGo
  • Added ZQE and PT packages in heading row of Table 6-53, Device DescriptorsGo
  • 添加了Section 7，器件和文档支持Go
  • 添加了Section 8机械、封装和可订购信息Go
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