ZHCSBX8I December 2013 – May 2018 OPA172 , OPA2172 , OPA4172
PRODUCTION DATA.
| THERMAL METRIC(1) | OPA4172 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | PW (TSSOP) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 82.7 | 111.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 42.3 | 40.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 37.3 | 54.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 8.9 | 3.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 37 | 53.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |