SBOS153B September   2000  – January 2016 OPA541

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Current Limit
      2. 8.1.2 Heat Sinking
      3. 8.1.3 Safe Operating Area
      4. 8.1.4 Replacing Hybrid Power Amplifiers
    2. 8.2 Typical Applications
      1. 8.2.1 Clamping Output for EMF-Generating Loads
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Power Supply Requirements
          2. 8.2.1.2.2 Current Limit and SOA (Safe Operating Area)
          3. 8.2.1.2.3 Heat Sinking
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Paralleled Operation, Extended SOA
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 Programmable Voltage Source
        1. 8.2.3.1 Design Requirements
      4. 8.2.4 16-Bit Programmable Voltage Source
        1. 8.2.4.1 Design Requirements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from A Revision (August 2006) to B Revision

  • Added ESD Ratings table, Thermal Information tables, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted THERMAL RESISTANCE section from Electrical CharacteristicsGo
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