ZHCSKG0J October   2019  – April 2021 OPA2607 , OPA607

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Output and Driving Capacitive Loads
      3. 8.3.3 Input and ESD Protection
      4. 8.3.4 Decompensated Architecture with Wide Gain-Bandwidth Product
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operating Mode
      2. 8.4.2 Power Down Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 100-kΩ Gain Transimpedance Design
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Noninverting Gain of 3 V/V
      3. 9.2.3 High-Input Impedance (Hi-Z), High-Gain Signal Front-End
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
      4. 9.2.4 Low-Cost, Low Side, High-Speed Current Sensing
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
      5. 9.2.5 Ultrasonic Flow Meters
        1. 9.2.5.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 支持资源
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision I (February 2021) to Revision J (April 2021)

  • 删除了器件信息 表中 VSSOP (8) 和 X2QFN (10) 封装的预发布声明Go
  • Removed the preview statement from the OPA2607 X2QFN (RUG) package and VSSOP (DGK) in the Device Comparison sectionGo
  • Removed the preview statement from the OPA2607 D, DGK and OPA2607 RUG package in the Pin Configuration and Functions sectionGo

Changes from Revision H (December 2020) to Revision I (February 2021)

  • 更新了数据表标题。Go

Changes from Revision G (October 2020) to Revision H (December 2020)

  • Updated the I/O and Descriptions in the Pin Functions—Single Channel tableGo

Changes from Revision F (September 2020) to Revision G (October 2020)

  • Removed the RUG Package 8-Pin X2QFN pinout to the Pin Configuration and Functions sectionGo
  • Removed the N/C pin decription from the Pin Functions – Single Channel tableGo
  • Changed  Overdrive Recovery Time from 0.25µs  to 0.3µs Go
  • Updated the Turn-On and Turn-Off Time figure in the Typical Characteristics sectionGo
  • Updated the Power Down Pin Bias Current vs Power Down Pin Voltage figure in the Typical Characteristics sectionGo
  • Updated the Input Offset Voltage vs Temperature figure in the Typical Characteristics sectionGo
  • Updated the Common Mode Rejection Ratio vs Temperature figure in the Typical Characteristics sectionGo
  • Updated the Short-Circuit Current vs Temperature figure in the Typical Characteristics sectionGo
  • Updated the Input Bias and Offset Current vs Temperature figure in the Typical Characteristics sectionGo
  • Updated the Output Voltage vs Output Current Sourcing and Sinking figure in the Typical Characteristics sectionGo
  • Added the Electromagnetic Interference Rejection Ratio Referred to Noninverting Input (EMIRR+) vs Frequency figure to the Typical Characteristics sectionGo
  • Added the Crosstalk vs Frequency figure to the Typical Characteristics sectionGo
  • Added the Quiescent Current vs Temperature figure to the Typical Characteristics sectionGo
  • Updated the Simulated Closed-Loop Bandwidth of TIA figure in the Application Curves sectionGo
  • Updated the Simulated Time Domain Response figures in the Application Curves sectionGo
  • Updated the Small-Signal Frequency Response in Gains of 3V/V (a) and 6V/V (b) figure in the Noninverting Gain of 3 V/V sectionGo
  • Updated the Small-Signal Frequency Response of Difference Amplifier (c) With and Without Noise Gain Shaping figures in the Noninverting Gain of 3 V/V sectionGo

Changes from Revision E (August 2020) to Revision F (September 2020)

  • Deleted blank CMRR specifications from Electrical Characteristics tableGo

Changes from Revision D (May 2020) to Revision E (August 2020)

  • 更新了整个文档的表、图和交叉参考的编号格式Go
  • 将 OPA2607 SOIC (8) 封装的状态从预发布 更改为正在供货 Go

Changes from Revision C (April 2020) to Revision D (May 2020)

  • 将状态从预告信息 更改为量产数据 Go

Changes from Revision B (February 2020) to Revision C (April 2020)

  • Added RUG Package 8-Pin X2QFN to the Pin Configurations and Functions sectionGo

Changes from Revision A (February 2020) to Revision B (February 2020)

  • 更新了 OPA607 作为低速 TIA 重要图形Go

Changes from Revision * (October 2019) to Revision A (February 2020)

  • Added OPA2607 D, DGK (Preview) and OPA2607 RUG Package (Preview) pinout drawings to the Pin Configuration and Functions sectionGo
  • Updated the OPA607 amplifiers specifications in the Rail-to-Rail Output and Driving Capacitive Loads sectionGo
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