ZHCSKG0J October   2019  – April 2021 OPA2607 , OPA607

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Output and Driving Capacitive Loads
      3. 8.3.3 Input and ESD Protection
      4. 8.3.4 Decompensated Architecture with Wide Gain-Bandwidth Product
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operating Mode
      2. 8.4.2 Power Down Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 100-kΩ Gain Transimpedance Design
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Noninverting Gain of 3 V/V
      3. 9.2.3 High-Input Impedance (Hi-Z), High-Gain Signal Front-End
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
      4. 9.2.4 Low-Cost, Low Side, High-Speed Current Sensing
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
      5. 9.2.5 Ultrasonic Flow Meters
        1. 9.2.5.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 支持资源
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) OPAx607 UNIT
D (SOIC) DGK  (VSSOP) DBV (SOT23) DCK (SC70) RUG (X2QFN)
8 PINS 8 PINS 5 PINS 6 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 131.1 179 196.5 219.7 152 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 73.2 71 118.7 182.6 58 °C/W
RθJB Junction-to-board thermal resistance 74.5 101 64.5 105.7 77 °C/W
ψJT Junction-to-top characterization parameter 24.5 13 41.1 87 1.2 °C/W
ψJB Junction-to-board characterization parameter 73.3 100 64.2 105.4 77 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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