SBAS448B October   2008  – August 2015 PCM1690

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Digital Input/Output
    6. 6.6  Electrical Characteristics: DAC
    7. 6.7  Electrical Characteristics: Power-Supply Requirements
    8. 6.8  System Clock Timing Requirements
    9. 6.9  Audio Interface Timing Requirements for Left-Justified, Right-Justified, and I2S Data Formats
    10. 6.10 Audio Interface Timing Requirements for DSP and TDM Data Formats
    11. 6.11 Three-Wire Serial Control Interface Timing Requirements
    12. 6.12 SCL and SDA Control Interface Timing Requirements
    13. 6.13 Typical Characteristics
      1. 6.13.1 Digital Filter
      2. 6.13.2 Digital De-Emphasis Filter
      3. 6.13.3 Dynamic Performance
      4. 6.13.4 Output Spectrum
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Outputs
      2. 7.3.2  Voltage Reference VCOM
      3. 7.3.3  System Clock Input
      4. 7.3.4  Sampling Mode
      5. 7.3.5  Reset Operation
      6. 7.3.6  Zero Flag
      7. 7.3.7  AMUTE Control
      8. 7.3.8  Three-Wire (SPI) Serial Control
      9. 7.3.9  Control Data Word Format
      10. 7.3.10 Register Write Operation
      11. 7.3.11 Two-Wire (I2C) Serial Control
      12. 7.3.12 Packet Protocol
      13. 7.3.13 Write Operation
      14. 7.3.14 Read Operation
      15. 7.3.15 Timing Requirements: SCL and SDA
    4. 7.4 Device Functional Modes
      1. 7.4.1 Audio Serial Port Operation
      2. 7.4.2 Audio Data Interface Formats and Timing
      3. 7.4.3 Synchronization With the Digital Audio System
      4. 7.4.4 Mode Control
      5. 7.4.5 Parallel Hardware Control
    5. 7.5 Register Maps
      1. 7.5.1 Control Register Definitions (Software Mode Only)
      2. 7.5.2 Register Definitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Lowpass Filter and Differential-to-Single-Ended Converter for DAC Outputs
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Hardware Control Method
        2. 8.2.2.2 Audio Input
        3. 8.2.2.3 Audio Output
        4. 8.2.2.4 Master Clock
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCA|48
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted).(1)
PARAMETER MIN MAX UNIT
Supply voltage VCC1, VCC2 –0.3 6.5 V
VDD –0.3 4 V
Ground voltage differences AGND1, AGND2, DGND –0.1 0.1 V
Supply voltage differences VCC1, VCC2 –0.1 0.1 V
Digital input voltage RST, TEST, MS, MC, MD, SCKI, AMUTEI, AMUTEO –0.3 6.5 V
BCK, LRCK, DIN1/2/3/4, MODE, ZERO1, ZERO2 –0.3 (VDD + 0.3) < 4 V
Analog input voltage VCOM, VOUT1–8± –0.3 (VCC + 0.3) < 6.5 V
Input current (all pins except supplies) –10 10 mA
Ambient temperature under bias –40 125 °C
Junction temperature 150 °C
Lead temperature (soldering, 5s) 260 °C
Package temperature (IR reflow, peak) 260 °C
Storage temperature Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted).
MIN NOM MAX UNIT
Analog supply voltage, VCC 4.5 5 5.5 V
Digital supply voltage, VDD 3 3.3 3.6 V
Digital Interface LVTTL compatible
Digital input clock frequency Sampling frequency, LRCK 8 192 kHz
System clock frequency, SCKI 2.048 36.864 MHz
Analog output voltage Differential 8 VPP
Analog output load resistance To AC-coupled GND 5 kΩ
To DC-coupled GND 15 kΩ
Analog output load capacitance 50 pF
Digital output load capacitance 20 pF
Operating free-air temperature PCM1690 consumer grade –40 25 85 °C

6.4 Thermal Information

THERMAL METRIC(1) PCM1690 UNIT
DCA (HTSSOP)
48 PINS
RθJA Junction-to-ambient thermal resistance 29.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 10.2 °C/W
RθJB Junction-to-board thermal resistance 10.3 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 10.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics: Digital Input/Output

All specifications at TA = 25°C, VCC1 = VCC2 = 5 V, VDD = 3.3 V, fS = 48 kHz, SCKI = 512 fS, 24-bit data, and Sampling Mode = Auto, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DATA FORMAT
fS Sampling frequency 8 48 192 kHz
System clock frequency 128 fS, 192 fS, 256 fS,
384 fS, 512 fS, 768 fS, 1152 fS		 2.048 36.864 MHz
INPUT LOGIC
VIH Input logic level, high (BCK, LRCK, and DIN (2)(1)) 2 VDD VDC
VIL Input logic level, low (BCK, LRCK, and DIN ((2)(1)) 0.8 VDC
VIH Input logic current, high (SCKI, ADR5/ADR1/RSV, MC/SCL/FMT, MD/SDA/DEMP, and AMUTEI(3)(4)) 2 5.5 VDC
VIL Input logic current, low (SCKI, ADR5/ADR1/RSV, MC/SCL/FMT, MD/SDA/DEMP, and AMUTEI(3)(4)) 0.8 VDC
IIH Input logic current, high (SCKI, TEST/ADR1/RSV, MC/SCL/FMT, MD/SDA/DEMP, and AMUTEI(1)(3)) VIN = VDD ±10 μA
IIL Input logic current, low (SCKI, TEST/ADR1/RSV, MC/SCL/FMT, MD/SDA/DEMP, and AMUTEI(1)(3)) VIN = 0 V ±10 μA
IIH Input logic current, high (BCK, LRCK, REST, MSI/ADR0/RSV (2)(4)) VIN = VDD 65 100 μA
IIL Input logic current, high (BCK, LRCK, REST, MSI/ADR0/RSV (2)(4)) VIN = 0 V ±10 μA
OUTPUT LOGIC
VOH Output logic level, high (ZERO1 and ZERO2(5)) IOUT = –4 mA 2.4 VDC
VOL Output logic level, low (ZERO1 and ZERO2(5)(6) ) IOUT = +4 mA 0.4 VDC
REFERENCE OUTPUT
VCOM output voltage 0.5 × VCC1 V
VCOM output impedance 7.5 kΩ
Allowable VCOM output source/sink current 1 μA
(1) DIN1/2/3/4 (Schmitt trigger input).
(2) BCK and LRCK (Schmitt trigger input with 50-kΩ typical internal pull-down resistor).
(3) SCKI, TEST/ADR1/RSV, MC/SCL/FMT, MD/SDA/DEMP, and AMUTEI (Schmitt trigger input, 5-V tolerant).
(4) RST and MS/ADR0/RSV (Schmitt trigger input with 50-kΩ typical internal pull-down resistor, 5-V tolerant).
(5) ZERO1 and ZERO2.
(6) SDA (I2C mode, open-drain low output) and AMUTEO (open-drain low output).

6.6 Electrical Characteristics: DAC

All specifications at TA = 25°C, VCC1 = VCC2 = 5 V, VDD = 3.3 V, fS = 48 kHz, SCKI = 512 fS, 24-bit data, and Sampling Mode = Auto, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
RESOLUTION 16 24 Bits
DC ACCURACY
Gain mismatch channel-to-channel ±2 ±6 % of FSR
Gain error ±2 ±6 % of FSR
Bipolar zero error ±1 % of FSR
DYNAMIC PERFORMANCE(1)(2)
THD+N Total harmonic distortion + noise fS = 48 kHz, VOUT = 0 dB –94 –88 dB
fS = 96 kHz, VOUT = 0 dB –94 dB
fS = 192 kHz, VOUT = 0 dB –94 dB
Dynamic range fS = 48 kHz, EIAJ, A-weighted 106 113 dB
fS = 96 kHz, EIAJ, A-weighted 113 dB
fS = 192 kHz, EIAJ, A-weighted 113 dB
SNR Sighnal-to-noise ratio fS = 48 kHz, EIAJ, A-weighted 106 113 dB
fS = 96 kHz, EIAJ, A-weighted 113 dB
fS = 192 kHz, EIAJ, A-weighted 113 dB
Channel separation
(between one channel and others)		 fS = 48 kHz 103 109 dB
fS = 96 kHz 109 dB
fS = 192 kHz 108 dB
ANALOG OUTPUT
Output voltage Differential 1.6 × VCC1 VPP
Center voltage 0.5 × VCC1 V
Load impedance To AC-coupled GND(3) 5 kΩ
To DC-coupled GND(3) 15 kΩ
LPF frequency response f = 20 kHz –0.04 dB
f = 44 kHz –0.18 dB
DIGITAL FILTER PERFORMANCE WITH SHARP ROLL-OFF
Passband (single, dual) Except SCKI = 128 fS and 192 fS 0.454 × fS Hz
SCKI = 128 fS and 192 fS 0.432 × fS Hz
Passband (quad) 0.432 × fS Hz
Stop band (single, dual) Except SCKI = 128 fS and 192 fS 0.546 × fS Hz
SCKI = 128 fS and 192 fS 0.569 × fS Hz
Stop band (quad) 0.569 × fS Hz
Passband ripple < 0.454 × fS, 0.432 × fS ±0.0018 dB
Stop band attenuation > 0.546 × fS, 0.569 × fS –75 dB
DIGITAL FILTER PERFORMANCE WITH SLOW ROLL-OFF
Passband 0.328 × fS Hz
Stop band 0.673 × fS Hz
Passband ripple < 0.328 × fS ±0.0013 dB
Stop band attenuation > 0.673 × fS –75 dB
DIGITAL FILTER PERFORMANCE
Group delay time (single, dual) Except SCKI = 128 fS and 192 fS 28/fS s
SCKI = 128 fS and 192 fS 19/fS s
Group delay time (quad) 19/fS s
De-emphasis error ±0.1 dB
(1) In differential mode at VOUTx± pin, fOUT = 1 kHz, using Audio Precision System II, Average mode with 20-kHz LPF and 400-Hz HPF.
(2) fS = 48 kHz: SCKI = 512 fS (single), fS = 96 kHz : SCKI = 256 fS (dual), fS = 192 kHz : SCKI = 128 fS (quad).
(3) Allowable minimum input resistance of differential to single-ended converter with D to S Gain = G is calculated as (1 + 2G)/(1 + G) × 5k for AC-coupled and (1+ 0.9G)/(1 + G) × 15k for DC-coupled connection; refer to Figure 39 and Figure 40 of the Application Information section.

6.7 Electrical Characteristics: Power-Supply Requirements

All specifications at TA = 25°C, VCC1 = VCC2 = 5 V, VDD = 3.3 V, fS = 48 kHz, SCKI = 512 fS, 24-bit data, and Sampling Mode = Auto, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER-SUPPLY REQUIREMENTS
VCC1/2 Voltage range 4.5 5 5.5 VDC
VDD 3 3.3 3.6 VDC
ICC Supply current fS = 48 kHz 74 110 mA
fS = 192 kHz 74 mA
Full power-down(1) 170 μA
fS = 48 kHz 57 90 mA
IDD fS = 192 kHz 76 mA
Full power-down(1) 60 μA
Power dissipation fS = 48 kHz fS = 192 kHz Full power-down(1) 558 847 mW
621 mW
1.05 mW
TEMPERATURE RANGE
Operating temperature PCM1690 Consumer grade –40 85 °C
(1) SCKI, BCK, and LRCK stopped.

6.8 System Clock Timing Requirements

(see Figure 1)
MIN MAX UNIT
tSCY System clock cycle time 27 ns
tSCH System clock width high 10 ns
tSCL System clock width low 10 ns
— System clock duty cycle 40% 60%

6.9 Audio Interface Timing Requirements for Left-Justified, Right-Justified, and I2S Data Formats

(see Figure 2)
MIN MAX UNIT
tBCY BCK cycle time 75 ns
tBCH BCK pulse width high 35 ns
tBCL BCK pulse width low 35 ns
tLRS LRCK set-up time to BCK rising edge 10 ns
tLRH LRCK hold time to BCK rising edge 10 ns
tDIS DIN1/2/3/4 set-up time to BCK rising edge 10 ns
tDIH DIN1/2/3/4 hold time to BCK rising edge 10 ns

6.10 Audio Interface Timing Requirements for DSP and TDM Data Formats

(see Figure 3)
MIN MAX UNIT
tBCY BCK cycle time 40 ns
tBCH BCK pulse width high 15 ns
tBCL BCK pulse width low 15 ns
tLRW LRCK pulse width high (DSP format) tBCY tBCY
LRCK pulse width high (TDM format) tBCY 1/fS – tBCY
tLRS LRCK set-up time to BCK rising edge 10 ns
tLRH LRCK hold time to BCK rising edge 10 ns
tDIS DIN1/2/3/4 set-up time to BCK rising edge 10 ns
tDIH DIN1/2/3/4 hold time to BCK rising edge 10 ns

6.11 Three-Wire Serial Control Interface Timing Requirements

(see Figure 4)
MIN MAX UNIT
tMCY MC pulse cycle time 100 ns
tMCL MC low-level time 40 ns
tMCH MC high-level time 40 ns
tMHH MS high-level time tMCY ns
tMSS MS falling edge to MC rising edge 30 ns
tMSH MS rising edge from MC rising edge for LSB 15 ns
tMDH MD hold time 15 ns
tMDS MD set-up time 15 ns

6.12 SCL and SDA Control Interface Timing Requirements

(see Figure 5)
STANDARD MODE FAST MODE UNIT
MIN MAX MIN MAX
fSCL SCL clock frequency 100 400 kHz
tBUF Bus free time between STOP and START condition 4.7 1.3 μs
tLOW Low period of the SCL clock 4.7 1.3 μs
tHI High period of the SCL clock 4 0.6 μs
tS-SU Set-up time for START/Repeated START condition 4.7 0.6 μs
tS-HD Hold time for START/Repeated START condition 4.0 0.6 μs
tD-SU Data set-up time 250 100 ns
tD-HD Data hold time 0 3450 0 900 ns
tSCL-R Rise time of SCL signal 1000 20 + 0.1 CB 300 ns
tSCL-F Fall time of SCL signal 1000 20 + 0.1 CB 300 ns
tSDA-R Rise time of SDA signal 1000 20 + 0.1 CB 300 ns
tSDA-F Fall time of SDA signal 1000 20 + 0.1 CB 300 ns
tP-SU Set-up time for STOP condition 4 0.6 μs
tGW Allowable glitch width N/A 50
CB Capacitive load for SDA and SCL line 400 100 pF
VNH Noise margin at high level for each connected device
(including hysteresis)		 0.2 × VDD 0.2 × VDD V
VNL Noise margin at low level for each connected device
(including hysteresis)		 0.1 × VDD 0.1 × VDD V
VHYS Hysteresis of Schmitt trigger input N/A 0.05 × VDD V
PCM1690 ai_tim_scki_bas448.gifFigure 1. System Clock Timing Requirements
PCM1690 ai_tim_audio_iface_lj-i2s_bas448.gifFigure 2. Audio Interface Timing Requirements for Left-Justified, Right-Justified, and I2S Data Formats
PCM1690 ai_tim_audio_iface_dsp_tdm_bas448.gifFigure 3. Audio Interface Timing Requirements for DSP and TDM Data Formats
PCM1690 ai_tim_ctrl_3wire_bas448.gifFigure 4. Three-Wire Serial Control Interface Timing
PCM1690 ai_tim_scl_sda_bas448.gifFigure 5. SCL and SDA Control Interface Timing

6.13 Typical Characteristics

6.13.1 Digital Filter

All specifications at TA = 25°C, VCC1 = VCC2 = 5 V, VDD = 3.3 V, fS = 48 kHz, SCKI = 512 fS, 24-bit data, and Sampling Mode = Auto, unless otherwise noted.

PCM1690 tc_fresp_pass_single_bas448.gif
Figure 6. Frequency Response Passband
(Single Rate)
PCM1690 tc_fresp_pass_dual_bas448.gif
Figure 8. Frequency Response Passband
(Dual Rate)
PCM1690 tc_fresp_pass_quad_bas448.gif
Figure 10. Frequency Response Passband
(Quad Rate)
PCM1690 tc_fresp_dual_bas448.gif
Figure 7. Frequency Response
(Dual Rate)
PCM1690 tc_fresp_quad_bas448.gif
Figure 9. Frequency Response
(Quad Rate)

6.13.2 Digital De-Emphasis Filter

All specifications at TA = 25°C, VCC1 = VCC2 = 5 V, VDD = 3.3 V, fS = 48 kHz, SCKI = 512 fS, 24-bit data, and Sampling Mode = Auto, unless otherwise noted.

PCM1690 tc_de_emp_48k_bas448.gif
fS = 48 kHz
Figure 11. De-emphasis Characteristic
PCM1690 tc_de_emp_32k_bas448.gif
fS = 32 kHz
Figure 13. De-emphasis Characteristic
PCM1690 tc_de_emp_44p1k_bas448.gif
fS = 44.1 kHz
Figure 12. De-emphasis Characteristic
PCM1690 tc_ana_filt_bas448.gif
Figure 14. Analog Filter Characteristic

6.13.3 Dynamic Performance

All specifications at TA = 25°C, VCC1 = VCC2 = 5 V, VDD = 3.3 V, fS = 48 kHz, SCKI = 512 fS, 24-bit data, and Sampling Mode = Auto, unless otherwise noted.

PCM1690 tc_thdn-tmp_bas448.gif
Figure 15. THD+N vs Temperature
PCM1690 tc_thdn-vs_bas448.gif
Figure 17. THD+N vs Supply Voltage
PCM1690 tc_range_snr-tmp_bas448.gif
Figure 16. Dynamic Range and SNR vs Temperature
PCM1690 tc_range_snr-vs_bas448.gif
Figure 18. Dynamic Range and SNR vs Supply Voltage

6.13.4 Output Spectrum

All specifications at TA = 25°C, VCC1 = VCC2 = 5 V, VDD = 3.3 V, fS = 48 kHz, SCKI = 512 fS, 24-bit data, and Sampling Mode = Auto, unless otherwise noted.

PCM1690 tc_ospec_0db_bas448.gif
0 dB, N = 32768
Figure 19. Output Spectrum
PCM1690 tc_ospec_bpz_bas448.gif
BPZ, N = 32768
Figure 21. Output Spectrum
PCM1690 tc_ospec_60db_bas448.gif
–60 dB, N = 32768
Figure 20. Output Spectrum
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