米6体育平台手机版

ZHCS823H March 2012 – March 2019 SN65HVD72 , SN65HVD75 , SN65HVD78

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

D|8
- MSOI002K
DRB|8
- MPDS118K
DGK|8
- MPDS028E

散热焊盘机械数据 (封装 | 引脚)

DRB|8
- QFND043N

订购信息

7.3 Recommended Operating Conditions

			MIN	NOM	MAX	UNIT
V_CC⁽³⁾	Supply voltage		3	3.3	3.6	V
V_I	Input voltage at any bus terminal (separately or common mode)⁽¹⁾		–7		12	V
V_IH	High-level input voltage (driver, driver enable, and receiver enable inputs)		2		V_CC	V
V_IL	Low-level input voltage (driver, driver enable, and receiver enable inputs)		0		0.8	V
V_ID	Differential input voltage		–12		12	V
I_O	Output current, driver		–60		60	mA
I_O	Output current, receiver		–8		8	mA
R_L	Differential load resistance		54	60		Ω
C_L	Differential load capacitance			50		pF
1/t_UI	Signaling rate	SN65HVD72			250	kbps
		SN65HVD75			20	Mbps
		SN65HVD78			50	Mbps
T_A⁽²⁾	Operating free-air temperature (See Thermal Information)		–40		125	°C
T_J	Junction temperature		–40		150	°C

(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum, is used in this data sheet.

(2) Operation is specified for internal (junction) temperatures up to 150°C. Self-heating due to internal power dissipation should be considered for each application. Maximum junction temperature is internally limited by the thermal shutdown (TSD) circuit which disables the driver outputs when the junction temperature reaches 170°C.

(3) Exposure to conditions beyond the recommended operation maximum for extended periods may affect device reliability.