SLLS516E August   2002  – July 2015 SN65LVDS100 , SN65LVDS101 , SN65LVDT100 , SN65LVDT101

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Receiver Features
        1. 10.3.1.1 Voltage Range and Common-Mode Range
        2. 10.3.1.2 Sensitivity
        3. 10.3.1.3 Failsafe Considerations
        4. 10.3.1.4 VBB Voltage Reference
        5. 10.3.1.5 Integrated Termination
        6. 10.3.1.6 Receiver Equivalent Schematic
      2. 10.3.2 Driver Features
        1. 10.3.2.1 Signaling Rate, Edge Rate, and Added Jitter
        2. 10.3.2.2 SN65LVDx100 LVDS Output
          1. 10.3.2.2.1 Driver Output Voltage
          2. 10.3.2.2.2 Driver Offset
        3. 10.3.2.3 SN65LVDx101 LVPECL Output
          1. 10.3.2.3.1 Driver Voltage
        4. 10.3.2.4 Driver Equivalent Schematics
    4. 10.4 Device Functional Modes
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 PECL to LVDS Translation
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Requirements
        3. 11.2.1.3 Application Curve
      2. 11.2.2 LVDS to 3.3-V PECL Translation
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Requirements
        3. 11.2.2.3 Application Curve
      3. 11.2.3 5-V PECL to 3.3-V PECL Translation
        1. 11.2.3.1 Design Requirements
        2. 11.2.3.2 Detailed Design Requirements
        3. 11.2.3.3 Application Curve
      4. 11.2.4 CML to LVDS or 3.3-V PECL Translation
        1. 11.2.4.1 Design Requirements
        2. 11.2.4.2 Detailed Design Requirements
        3. 11.2.4.3 Application Curve
      5. 11.2.5 Single-Ended 3.3-V PECL to LVDS Translation
        1. 11.2.5.1 Design Requirements
        2. 11.2.5.2 Detailed Design Requirements
        3. 11.2.5.3 Application Curve
      6. 11.2.6 Single-Ended CMOS to LVDS Translation
        1. 11.2.6.1 Design Requirements
        2. 11.2.6.2 Detailed Design Requirements
        3. 11.2.6.3 Application Curve
      7. 11.2.7 Single-Ended CMOS to 3.3-V PECL Translation
        1. 11.2.7.1 Design Requirements
        2. 11.2.7.2 Detailed Design Requirements
        3. 11.2.7.3 Application Curve
      8. 11.2.8 Receipt of AC-Coupled Signals
        1. 11.2.8.1 Design Requirements
        2. 11.2.8.2 Detailed Design Requirements
        3. 11.2.8.3 Application Curve
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Microstrip vs. Stripline Topologies
      2. 13.1.2 Dielectric Type and Board Construction
      3. 13.1.3 Recommended Stack Layout
      4. 13.1.4 Separation Between Traces
      5. 13.1.5 Crosstalk and Ground Bounce Minimization
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Related Links
    2. 14.2 Community Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DGK|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from D Revision (December 2014) to E Revision

  • Changed Features From: "Over 0-V to 4-V Common-Mode Range" To: "Over 0-V to 4-V Input Voltage Range"Go

Changes from C Revision (June 2004) to D Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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