ZHCSO94D October   2003  – September 2021 SN74CB3Q3305

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 描述
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions (1)
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCU|8
  • PW|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1) SN74CB3Q3305 SN74CB3Q3305 UNIT
DCU (VSSOP) PW (TSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 183 190.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 64.2 74.0 °C/W
RθJB Junction-to-board thermal resistance 62.5 119.4 °C/W
ψJT Junction-to-top characterization parameter 4.3 120.0 °C/W
ψJB Junction-to-board characterization parameter 62.1 117.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.