SCES469F August   2003  – March 2020 SN74LVC1404

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics, CL = 15 pF
    7. 7.7 Switching Characteristics, CL = 30 pF or 50 pF
    8. 7.8 Operating Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Testing
      3. 10.2.3 Application Curves
        1. 10.2.3.1 LVC1404 in 25-MHz Crystal-Oscillator Circuit
        2. 10.2.3.2 LVC1404 in 10-MHz Crystal-Oscillator Circuit
        3. 10.2.3.3 LVC1404 in 2-MHz Crystal-Oscillator Circuit
        4. 10.2.3.4 LVC1404 in 100-kHz Crystal-Oscillator Circuit
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Trademarks
    2. 13.2 Electrostatic Discharge Caution
    3. 13.3 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCU|8
  • YZP|8
  • DCT|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Revision History

Changes from E Revision (June 2014) to F Revision

  • Formatted pinout figures for search capabilityGo
  • Corrected pin numbering for the DSBGA package to match the mechanical drawing Go
  • Changed ESD Ratings table format to comply with JEDEC standards Go
  • Added YZP TA MIN /MAX specs and package thermal information Go

Changes from D Revision (January 2007) to E Revision

  • Updated document to new TI data sheet format.Go
  • Removed Ordering Information table. Go
  • Added Applications.Go
  • Added Device Information table.Go
  • Added Handling Ratings table. Go
  • Changed MAX ambient temperature to 125°C.Go
  • Added Thermal Information table.Go
  • Added Typical Characteristics. Go
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |