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ZHCSM01AE February 2000 – September 2020 SN74LVC1G07

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

DRY|6
- MPDS221F
DRL|5
- MPDS158F
DSF|6
- MPDS301G
DPW|5
- MPSS088
DCK|5
- MPDS025J
YZP|5
- MXBG018L
DBV|5
- MPDS018T
YZV|4
- MXBG052B

散热焊盘机械数据 (封装 | 引脚)

DRY|6
- QFND138E
DPW|5
- QFND567C

订购信息

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

			MIN	MAX	UNIT
V_CC	Supply voltage	Operating	1.65	5.5	V
V_CC	Supply voltage	Data retention only	1.5		V
V_IH	High-level input voltage	V_CC = 1.65 V to 1.95 V	0.65 × V_CC		V
		V_CC = 2.3 V to 2.7 V	1.7
		V_CC = 3 V to 3.6 V	2
		V_CC = 4.5 V to 5.5 V	0.7 × V_CC
V_IL	Low-level input voltage	V_CC = 1.65 V to 1.95 V		0.35 × V_CC	V
		V_CC = 2.3 V to 2.7 V		0.7
		V_CC = 3 V to 3.6 V		0.8
		V_CC = 4.5 V to 5.5 V		0.3 × V_CC
V_I	Input voltage		0	5.5	V
V_O	Output voltage		0	5.5	V
I_OL	Low-level output current	V_CC = 1.65 V		4	mA
		V_CC = 2.3 V		8
		V_CC = 3 V		16
		V_CC = 3 V		24
		V_CC = 4.5 V		32
Δt/Δv	Input transition rise or fall rate	V_CC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V		20	ns/V
		V_CC = 3.3 V ± 0.3 V		10
		V_CC = 5 V ± 0.5 V		5
T_A	Operating free-air temperature	DSBGA package	–40	85	°C
T_A	Operating free-air temperature	All other packages	–40	125	°C

(1) All unused inputs of the device must be held at V_CC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.