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ZHCSHF2E August 2004 – January 2018 SN74LVC1G139

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		SN74LVC1G139			UNIT
		DCT (SM8)	DCU (VSSOP)	YZP (DSBGA)
		8 PINS	8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	194	195	106	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	124	74	1.6	°C/W
R_θJB	Junction-to-board thermal resistance	106	74	11	°C/W
ψ_JT	Junction-to-top characterization parameter	48	6.7	3.1	°C/W
ψ_JB	Junction-to-board characterization parameter	105	73	11	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	—	—	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.