SCES218Y APRIL   1999  – November 2018 SN74LVC1G14

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Logic Diagram (Positive Logic) (DBV, DCK, DRL, DRY, DPW, and YZP Package)
      2.      Logic Diagram (Positive Logic) (YZV Package)
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics: –40°C to 85°C
    7. 6.7 Switching Characteristics: –40°C to 125°C
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 8.3.2 CMOS Schmitt-Trigger Inputs
      3. 8.3.3 Clamp Diodes
      4. 8.3.4 Partial Power Down (Ioff)
      5. 8.3.5 Over-Voltage Tolerant Inputs
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • YZV|4
  • DRL|5
  • YZP|5
  • DRY|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from X Revision (August 2017) to Y Revision

  • Changed New package pinout added to Pin Functions table. Multiple Pin Functions tables condensed to one.Go
  • Changed Tj and Tstg lines switched for consistency with other devices.Go
  • Added differentiated ROC temperatures for DPW, YZP and YZV packages Go
  • Changed format of Switching Characteristics tables to include columns for different CL conditions Go
  • Added temperature range to Conditions statement for Switching Characteristics tables Go
  • Replaced PMI section with updated load circuit and relevant waveform figures. Collapsed parameter measurement values into one table.Go

Changes from W Revision (March 2014) to X Revision

  • Added Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, and Layout sectionGo
  • Added DSF, YZP, YZV, and DPW packages to Device Information tableGo
  • Changed Terminal Configuration and Functions to Pin Configuration and FunctionsGo
  • Moved Storage temperature, Tstg to Absolute Maximum Ratings table.Go
  • Changed Handling Ratings table to ESD RatingsGo
  • Changed values in the Thermal Information table to align with JEDEC standards. Go
  • Added typical application.Go
  • Added Documentation Support, Receiving Notification of Documentation Updates, and Community ResourcesGo

Changes from V Revision (Novmber 2012) to W Revision

  • Added DPW PackageGo
  • Added ApplicationsGo
  • Moved Tstg to Handling Ratings tableGo
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