ZHCSLJ9E October   1998  – July 2020 SN74LVCH32373A

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     6
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Operating Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Standard CMOS Inputs
      2. 7.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 7.3.3 Partial Power Down (Ioff)
      4. 7.3.4 Over-voltage Tolerant Inputs
      5. 7.3.5 Clamp Diode Structure
      6. 7.3.6 Bus-Hold Data Inputs
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Power Considerations
        2. 8.2.1.2 Input Considerations
        3. 8.2.1.3 Output Considerations
        4. 8.2.1.4 Timing Considerations
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • NMJ|96
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision D (March 2005) to Revision E (July 2020)

  • 全局更改为新的 TI 数据表格式Go
  • 添加了“应用”列表、“器件信息”表和重要图形Go
  • Added maximum junction temperature Go
  • Added ESD Ratings section Go
  • Added Thermal Information section Go
  • Added Typical Characteristics section Go
  • Added Detailed Description section Go
  • Added Application and Implementation section Go
  • Added Power Supply Recommendations section and Layout section Go
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