ZHCSRE9C August   2005  – December 2022 SN74LVCH8T245

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    7. 6.7  Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    8. 6.8  Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    9. 6.9  Switching Characteristics: VCCA = 5 V ± 0.5 V
    10. 6.10 Operating Characteristics
    11. 6.11 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fully Configurable Dual-Rail Design
      2. 8.3.2 Partial-Power-Down Mode Operation
      3. 8.3.3 Active Bus Hold Circuitry
      4. 8.3.4 Balanced High-Drive CMOS Push-Pull Outputs
      5. 8.3.5 VCC Isolation
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Enable Times
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1) SN74LVCH8T245 UNIT
DB (SSOP) DGV (TVSOP) PW (TSSOP) RHL (VQFN)
24 PINS 24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 88.5 91.1

100.6

37.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 48.7 23.7

44.7

38.1 °C/W
RθJB Junction-to-board thermal resistance 44.1 44.5

55.8

15.2 °C/W
ψJT Junction-to-top characterization parameter 12.8 0.6

6.8

0.7 °C/W
ψJB Junction-to-board characterization parameter 43.6 44.1

55.4

15.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.3 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.