ZHCSI92D May   2018  – November 2020 TAS5805M

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
      1. 6.7.1 Bridge Tied Load (BTL) Configuration Curves with 1SPW Mode
      2. 6.7.2 Bridge Tied Load (BTL) Configuration Curves with BD Mode
      3. 6.7.3 Bridge Tied Load (BTL) Configuration Curves with Ferrite Bead + Capacitor as the Output Filter
      4. 6.7.4 Parallel Bridge Tied Load (PBTL) Configuration with 1SPW Modulation
      5. 6.7.5 Parallel Bridge Tied Load (PBTL) Configuration with BD Modulation
  8. 7 Parameter Measurement Information
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Supplies
      2. 7.3.2 Device Clocking
      3. 7.3.3 Serial Audio Port – Clock Rates
      4. 7.3.4 Clock Halt Auto-recovery
      5. 7.3.5 Sample Rate on the Fly Change
      6. 7.3.6 Serial Audio Port - Data Formats and Bit Depths
      7. 7.3.7 Digital Audio Processing
      8. 7.3.8 Class D Audio Amplifier
        1. 7.3.8.1 Speaker Amplifier Gain Select
        2. 7.3.8.2 Class D Loop Bandwidth and Switching Frequency Setting
    4. 7.4 Device Functional Modes
      1. 7.4.1 Software Control
      2. 7.4.2 Speaker Amplifier Operating Modes
        1. 7.4.2.1 BTL Mode
        2. 7.4.2.2 PBTL Mode
      3. 7.4.3 Low EMI Modes
        1. 7.4.3.1 Spread Spectrum
        2. 7.4.3.2 Channel to Channel Phase Shift
        3. 7.4.3.3 Multi-Devices PWM Phase Synchronization
      4. 7.4.4 Thermal Foldback
      5. 7.4.5 Device State Control
      6. 7.4.6 Device Modulation
        1. 7.4.6.1 BD Modulation
        2. 7.4.6.2 1SPW Modulation
        3. 7.4.6.3 Hybrid Modulation
    5. 7.5 Programming and Control
      1. 7.5.1 I2 C Serial Communication Bus
      2. 7.5.2 Slave Address
        1. 7.5.2.1 Random Write
        2. 7.5.2.2 Sequential Write
        3. 7.5.2.3 Random Read
        4. 7.5.2.4 Sequential Read
        5. 7.5.2.5 DSP Memory Book, Page and BQ Coefficients Update
        6. 7.5.2.6 Example Use
        7. 7.5.2.7 Checksum
          1. 7.5.2.7.1 Cyclic Redundancy Check (CRC) Checksum
          2. 7.5.2.7.2 Exclusive or (XOR) Checksum
      3. 7.5.3 Control via Software
        1. 7.5.3.1 Startup Procedures
        2. 7.5.3.2 Shutdown Procedures
        3. 7.5.3.3 Protection and Monitoring
          1. 7.5.3.3.1 Overcurrent Shutdown (OCSD)
          2. 7.5.3.3.2 Speaker DC Protection
          3. 7.5.3.3.3 Device Over Temperature Protection
          4. 7.5.3.3.4 Device Over Voltage/Under Voltage Protection
            1. 7.5.3.3.4.1 Over Voltage Protection
            2. 7.5.3.3.4.2 Under Voltage Protection
          5. 7.5.3.3.5 Clock Fault
    6. 7.6 Register Maps
      1. 7.6.1 CONTROL PORT Registers
  10. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bootstrap Capacitors
      2. 8.1.2 Inductor Selections
      3. 8.1.3 Power Supply Decoupling
      4. 8.1.4 Output EMI Filtering
    2. 8.2 Typical Applications
      1. 8.2.1 2.0 (Stereo BTL) System
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedures
          1. 8.2.1.2.1 Step 1: Hardware Integration
          2. 8.2.1.2.2 Step 2: Speaker Tuning
          3. 8.2.1.2.3 Step 3: Software Integration
        3. 8.2.1.3 Application Curves
          1. 8.2.1.3.1 Audio Performance
          2. 8.2.1.3.2 EN55022 Conducted Emissions Results with Ferrite Bead as output filter
          3. 8.2.1.3.3 EN55022 Radiated Emissions Results with Ferrite Bead as output filter
      2. 8.2.2 MONO (PBTL) Systems
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Advanced 2.1 System (Two TAS5805M Devices)
  11. 9 Power Supply Recommendations
    1. 9.1 DVDD Supply
    2. 9.2 PVDD Supply
  12. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 General Guidelines for Audio Amplifiers
      2. 9.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network
      3. 9.1.3 Optimizing Thermal Performance
        1. 9.1.3.1 Device, Copper, and Component Layout
        2. 9.1.3.2 Stencil Pattern
          1. 9.1.3.2.1 PCB footprint and Via Arrangement
          2. 9.1.3.2.2 Solder Stencil
    2. 9.2 Layout Example
  13. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Device Nomenclature
      2. 10.1.2 Development Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  14. 11Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PWP|28
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision C (December 2018) to Revision D (November 2020)

  • Added note 1 to the Recommended Operating Conditions Go
  • Added capacitve load for each bus line, Cb = 400 pf to the I2C timming parameters in the Timing Requirements Go
  • Change the I2C BUS Timming-Standard. Data Hold Time max value from 900 ns to 3450 ns in the Timing Requirements Go
  • Added efficiency plot and 1%/10% THD+N output power vs PVDD plot for 4-Ω loadGo
  • Added notes the Hybrid Modulation sectionGo
  • Added Speaker DC Protection, Device Over Temperature Protection, Device Over Voltage/Under Voltage Protection, and Clock Fault sectionsGo

Changes from Revision B (October 2018) to Revision C (December 2018)

Changes from Revision A (July 2018) to Revision B (October 2018)

  • 在说明 中将“（13.5V PVDD 下小于 16.5mA）”更改为“（13.5V PVDD 下为 16.5mA）”Go
  • Changed the Typical Characteristics graphsGo
  • Added the Clock Halt Auto-recover sectionGo
  • Added the Sample Rate on the Fly Change sectionGo
  • Added the Thermal Foldback sectionGo
  • Changed the Device State Control sectionGo
  • Changed the DSP Memory Book, Page and BQ Coefficients Update sectionGo
  • Added the Example Use sectionGo
  • Deleted 010:310K in Table 7-9 Go
  • Added the Inductor Selections sectionGo
  • Added the Step 2: Speaker Tuning sectionGo
  • Changed the Development Support sectionGo

Changes from Revision * (May 2018) to Revision A (July 2018)

  • 发布为“量产数据”Go
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