ZHCSLW4A March   2020  – September 2020 TCAN1046-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Characteristics
    5. 6.5 Supply Characteristics
    6. 6.6 Dissipation Ratings
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1 TXD1 and TXD2
        2. 8.3.1.2 GND1 and GND2
        3. 8.3.1.3 VCC1 and VCC2
        4. 8.3.1.4 RXD1 and RXD2
        5. 8.3.1.5 CANH1, CANL1, CANH2, and CANL1
        6. 8.3.1.6 STB1 and STB2 (Standby)
      2. 8.3.2 CAN Bus States
      3. 8.3.3 TXD Dominant Timeout (DTO)
      4. 8.3.4 CAN Bus Short Circuit Current Limiting
      5. 8.3.5 Thermal Shutdown (TSD)
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Unpowered Device
      8. 8.3.8 Floating pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
      2. 8.4.2 Normal Mode
      3. 8.4.3 Standby Mode
        1. 8.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 8.4.4 Driver and Receiver Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 CAN Termination
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Characteristics

THERMAL METRIC(1)TCAN1046-Q1UNIT
D (SOIC)DMT (VSON)
RθJAJunction-to-ambient thermal resistance70.635.5℃/W
RθJC(top)Junction-to-case (top) thermal resistance33.438.1℃/W
RθJBJunction-to-board thermal resistance34.013.4℃/W
ΨJTJunction-to-top characterization parameter5.01.9℃/W
ΨJBJunction-to-board characterization parameter32.613.4℃/W
RθJC(bot)Junction-to-case (bottom) thermal resistance–3.5℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |