ZHCSKS4G october   2009  – august 2023 TL331-Q1 , TL331B-Q1 , TL391B-Q1

PRODMIX  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings, TL331-Q1
    2. 6.2  Absolute Maximum Ratings, TL331B-Q1 and TL391B-Q1
    3. 6.3  ESD Ratings, All Devices
    4. 6.4  Recommended Operating Conditions, TL331-Q1
    5. 6.5  Recommended Operating Conditions, TL331B-Q1 and TL391B-Q1
    6. 6.6  Thermal Information
    7. 6.7  Electrical Characteristics, TL331B-Q1 and TL391B-Q1
    8. 6.8  Switching Characteristics, TL331B-Q1 and TL391B-Q1
    9. 6.9  Electrical Characteristics, TL331-Q1
    10. 6.10 Switching Characteristics, TL331-Q1
    11. 6.11 Typical Characteristics, TL331-Q1
    12. 6.12 Typical Characteristics, TL331B-Q1 and TL391B-Q1
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage Comparison
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Range
        2. 8.2.2.2 TL331B-Q1 and TL391B-Q1 ESD Protection
        3. 8.2.2.3 Minimum Overdrive Voltage
        4. 8.2.2.4 Output and Drive Current
        5. 8.2.2.5 Response Time
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Thermal Information

THERMAL METRIC(1)TL331-Q1TL331B-Q1,
TL391B-Q1		UNIT
DBV (SOT-23)DBV (SOT-23)
5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance218.3211.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance87.3133.6°C/W
RθJBJunction-to-board thermal resistance44.979.9°C/W
ψJTJunction-to-top characterization parameter4.356.4°C/W
ψJBJunction-to-board characterization parameter44.179.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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