ZHCSRJ6D June   2010  – October 2024 TLV320AIC3104-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics I2S/LJF/RJF Timing in Master Mode
    7. 6.7  Switching Characteristics I2S/LJF/RJF Timing in Slave Mode
    8. 6.8  Switching Characteristics DSP Timing in Master Mode
    9. 6.9  Switching Characteristics DSP Timing in Slave Mode
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Audio Data Converters
      2. 7.3.2  Stereo Audio ADC
        1. 7.3.2.1 Stereo Audio ADC High-Pass Filter
      3. 7.3.3  Automatic Gain Control (AGC)
      4. 7.3.4  Stereo Audio DAC
      5. 7.3.5  Digital Audio Processing for Playback
      6. 7.3.6  Digital Interpolation Filter
      7. 7.3.7  Delta-Sigma Audio DAC
      8. 7.3.8  Audio DAC Digital Volume Control
      9. 7.3.9  Analog Output Common-mode Adjustment
      10. 7.3.10 Audio DAC Power Control
      11. 7.3.11 Audio Analog Inputs
      12. 7.3.12 Analog Input Bypass Path Functionality
      13. 7.3.13 ADC PGA Signal Bypass Path Functionality
      14. 7.3.14 Input Impedance and VCM Control
      15. 7.3.15 MICBIAS Generation
      16. 7.3.16 Analog Fully Differential Line Output Drivers
      17. 7.3.17 Analog High-Power Output Drivers
      18. 7.3.18 Short-Circuit Output Protection
      19. 7.3.19 Jack and Headset Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital Audio Processing for Record Path
      2. 7.4.2 Increasing DAC Dynamic Range
      3. 7.4.3 Passive Analog Bypass During Power Down
      4. 7.4.4 Hardware Reset
    5. 7.5 Programming
      1. 7.5.1  Digital Control Serial Interface
      2. 7.5.2  I2C Control Interface
      3. 7.5.3  I2C Bus Debug in a Glitched System
      4. 7.5.4  Digital Audio Data Serial Interface
      5. 7.5.5  Right-Justified Mode
      6. 7.5.6  Left-Justified Mode
      7. 7.5.7  I2S Mode
      8. 7.5.8  DSP Mode
      9. 7.5.9  TDM Data Transfer
      10. 7.5.10 Audio Clock Generation
  9. 8 Register Maps
    1. 8.1 Output Stage Volume Controls
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 External Speaker Driver in Infotainment and Cluster Applications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 External Speaker Amplifier With Separate Line Outputs
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Device Nomenclature
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Revision History

Changes from Revision C (January 2023) to Revision D (October 2024)

  • 通篇更新了数据表格式Go
  • Updated Junction Temperature Max Rating Go

Changes from Revision B (February 2017) to Revision C (January 2023)

  • Added TLV320ATC3104-Q1 to orderable table.Go

Changes from Revision A (March 2016) to Revision B (February 2017)

  • Changed the Input Impedance and VCM Control section.Go
  • Changed the Hardware Reset sectionGo
  • Added the Receiving Notification of Documentation Updates sectionGo
  • Changed the Electrostatic Discharge Caution statementGo

Changes from Revision * (June 2010) to Revision A (March 2016)

  • 添加了器件信息 表、引脚配置和功能 部分、规格 部分、特性说明 部分、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
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