ZHCSFX0B November   2016  – August 2017 TLV2316-Q1 , TLV316-Q1 , TLV4316-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TLV316-Q1
    5. 7.5 Thermal Information: TLV2316-Q1
    6. 7.6 Thermal Information: TLV4316-Q1
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics: Table of Graphs
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 8.3.5 Capacitive Load and Stability
      6. 8.3.6 EMI Susceptibility and Input Filtering
      7. 8.3.7 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 System Examples
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档　
    2. 12.2 相关链接
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (December 2016) to B Revision

  • 更正了输入错误；在特性 部分中将部件号从 TLV314、TLV2314 和 TLV4314 更改为 TLV316-Q1、TLV2316-Q1 和 TLV4316-Q1Go
  • Changed values in the Thermal Information: TLV4316-Q1 table to align with JEDEC standards.Go

Changes from * Revision (November 2016) to A Revision

  • Changed CDM ESD 分类等级 C6 至 C5（位于 特性 部分）Go
  • Deleted 器件信息表Go
  • Deleted the DCK (SC70) package from the TLV316-Q1 pinout diagram in the Pin Configurations and Functions section Go
  • Deleted the DCK (SC70) pinout information from the Pin Functions: TLV316-Q1 table in the Pin Configurations and Functions section Go
  • Deleted D (SOIC) package from the TLV2316-Q1 pinout diagram in the Pin Configurations and Functions section Go
  • Deleted the D (SOIC) package from TLV4316-Q1 pinout diagram in the Pin Configurations and Functions sectionGo
  • Changed the ESD Ratings table from commercial to automotive specifications Go
  • Changed the CDM ESD rating from ±1500 to ±750 in the ESD Ratings table Go
  • Deleted the DCK (SC70) package from the Thermal Information: TLV316-Q1 table in the Specifications sectionGo
  • Changed the formatting of all Thermal Information table notes Go
  • Deleted the D (SOIC) package from the Thermal Information: TLV2316-Q1 table in the Specifications sectionGo
  • Deleted the D (SOIC) package from the Thermal Information: TLV4316-Q1 table in the Specifications section Go
  • Deleted the static literature number in the SBOA128 application note reference in the EMI Susceptibility and Input Filtering sectionGo
  • Deleted the static literature number in document reference in the Layout Guidelines section Go
  • Changed the layout example image (Figure 41) in Layout Example sectionGo
  • Deleted 相关文档部分Go
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