ZHCSGK4E
September 2017 – November 2019
TLV7011
,
TLV7012
,
TLV7021
,
TLV7022
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
X2SON 封装与 SC70 和美元硬币对比
传播延迟与过驱动
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
Pin Functions: TLV7012/22
6
Specifications
6.1
Absolute Maximum Ratings (Single)
6.2
Absolute Maximum Ratings (Dual)
6.3
ESD Ratings
6.4
Recommended Operating Conditions (Single)
6.5
Recommended Operating Conditions (Dual)
6.6
Thermal Information (Single)
6.7
Thermal Information (Dual)
6.8
Electrical Characteristics (Single)
6.9
Switching Characteristics (Single)
6.10
Electrical Characteristics (Dual)
6.11
Switching Characteristics (Dual)
6.12
Timing Diagrams
6.13
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.4
Device Functional Modes
7.4.1
Inputs
7.4.2
Internal Hysteresis
7.4.3
Output
8
Application and Implementation
8.1
Application Information
8.1.1
Inverting Comparator With Hysteresis for TLV701x
8.1.2
Noninverting Comparator With Hysteresis for TLV701x
8.2
Typical Applications
8.2.1
Window Comparator
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curve
8.2.2
IR Receiver Analog Front End
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
8.2.2.3
Application Curve
8.2.3
Square-Wave Oscillator
8.2.3.1
Design Requirements
8.2.3.2
Detailed Design Procedure
8.2.3.3
Application Curve
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
器件和文档支持
11.1
器件支持
11.1.1
开发支持
11.1.1.1
评估模块
11.2
相关链接
11.3
接收文档更新通知
11.4
社区资源
11.5
商标
11.6
静电放电警告
11.7
Glossary
12
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
DPW|5
MPSS088
DCK|5
MPDS025J
DBV|5
MPDS018T
散热焊盘机械数据 (封装 | 引脚)
DPW|5
QFND567C
订购信息
zhcsgk4e_oa
zhcsgk4e_pm
6.13
Typical Characteristics
T
A
= 25°C, V
CC
= 5 V, V
EE
= 0 V, V
CM
= V
CC
/2, C
L
= 15 pF
T
A
= 25°C,
Figure 3.
TLV7011 Propagation Delay (L-H) vs. Input Overdrive
V
CC
= 5 V
Figure 5.
TLV7011 Propagation Delay (L-H) vs. Input Overdrive
R
pull-up
= 2.5k
Figure 7.
TLV7021 Propagation Delay (L-H) vs. Input Overdrive
V
CC
= 3.3 V
Figure 9.
Hysteresis vs. Temperature
V
CC
= 1.8 V
Figure 11.
Hysteresis vs. V
CM
V
CC
= 5 V
Figure 13.
Hysteresis vs. V
CM
V
CC
= 1.8 V
Figure 15.
Input Offset vs. Temperature
V
CC
= 5 V
Figure 17.
Input Offset vs. Temperature
V
CC
= 3.3 V, 50 devices
Figure 19.
Input Offset Voltage vs. V
CM
Distribution Taken From 10,777 Comparators
Figure 21.
Input Offset Voltage Histogram
V
CC
= 5 V
Figure 23.
TLV7011 Output Voltage High vs. Output Source Current
V
CC
= 5 V
Figure 25.
Output Voltage Low vs. Output Sink Current
V
CM
= V
CC
/2
Figure 27.
TLV7011 Output Short-Circuit (Source) Current vs. Temperature
A.
V
CM
= V
CC
/2
Figure 29.
TLV7011 Output Short Circuit (Source) vs. V
CC
V
CM
= V
CC
/2
Figure 31.
I
CC
vs. V
CC
V
CC
= 5 V
Figure 33.
I
CC
vs. V
CM
A.
V
OD
= 100mV
Figure 35.
TLV7011 Output Rise Time vs. Load Capacitance
T
A
= 25°C
Figure 4.
Propagation Delay (H-L) vs. Input Overdrive
V
CC
= 5 V
Figure 6.
Propagation Delay (H-L) vs. Input Overdrive
V
CC
= 1.8 V
Figure 8.
Hysteresis vs. Temperature
V
CC
= 5 V
Figure 10.
Hysteresis vs. Temperature
V
CC
= 3.3 V
Figure 12.
Hysteresis vs. V
CM
Distribution Taken From 10,777 Comparators
Figure 14.
Hysteresis Histogram
V
CC
= 3.3 V
Figure 16.
Input Offset vs. Temperature
V
CC
= 1.8 V, 50 devices
Figure 18.
Input Offset Voltage vs. V
CM
V
CC
= 5 V, 50 devices
Figure 20.
Input Offset Voltage vs. V
CM
V
CC
= 1.8 V
Figure 22.
TLV7011 Output Voltage High vs. Output Source Current
V
CC
= 1.8 V
Figure 24.
Output Voltage Low vs. Output Sink Current
V
CM
= V
CC
/2
Figure 26.
Output Short-Circuit (Sink) Current vs. Temperature
V
CM
= V
CC
/2
Figure 28.
Output Short Circuit (Sink) vs. V
CC
V
CM
= V
CC
/2
Figure 30.
I
CC
vs. Temperature
V
CC
= 3.3 V
Figure 32.
I
CC
vs. V
CM
A.
V
CC
= 3.3V
Figure 34.
Input Bias Current vs. Temperature
A.
V
OD
= 100mV
Figure 36.
Output Fall Time vs. Load Capacitance
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