SBVS151F December   2010  – April 2017 TLV705 , TLV705P

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Undervoltage Lockout (UVLO)
      3. 7.3.3 Start-Up Current
      4. 7.3.4 Dropout Voltage
      5. 7.3.5 Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Power Dissipation and Junction Temperature
    5. 10.5 Estimating Junction Temperature
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Mounting

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from E Revision (May 2015) to F Revision

  • Deleted "x" from TLV705 device in document title Go
  • Changed package dimensions in document title from "0.8-mm × 0.8-mm" to "0.77-mm × 0.77-mm" Go
  • Changed ultra-low profile maximum height from 0.2-mm to 0.15-mm in Applications section Go
  • Changed package dimensions in Description section from 0.8-mm to 0.77-mm.Go
  • Changed DSBGA package dimensions from "0.80 mm × 0.80 mm" to "0.77 mm × 0.77 mm" in the Device Information table Go
  • Added copyright statement to the Typical Application Circuit Go
  • Changed formatting of Thermal Information table note Go
  • Deleted "x" from device number in Thermal Information table Go
  • Added copyright statement to functional block diagrams in Functional Block Diagrams section Go
  • Added copyright statement to Typical Application Circuit (Fixed-Voltage Versions) in the Typical Application section Go
  • Changed formatting of document reference in Related Documentation section Go
  • Changed table header title from "Sample & Buy" to "Order Now" in the Related Links table Go

Changes from D Revision (April 2015) to E Revision

  • Added new package (YFM) to document Go
  • Added PicoStar to title Go
  • Changed last Features bullet Go
  • Changed last sentence of Description section Go
  • Added second row to Device Information table Go
  • Added YFM pin out drawingGo
  • Added YFM package to Thermal Information table Go
  • Changed VO parameter units in Electrical Characteristics table: % for first row, mV for second rowGo
  • Changed first sentence of Overview section: removed new Go
  • Changed fifth sentence of Internal Current Limit section to clarify description of the shutdown circuit functionality Go
  • Changed Vµs to V/µs in second paragraph of Start-Up Current section Go
  • Changed it to the start-up current in third paragraph of Start-Up Current section Go
  • Changed INPUT to VIN in Power Supply Recommendations section Go
  • Added Related Links section Go
  • Added YFM package to Package Mounting section Go

Changes from C Revision (October 2012) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added Features bullet for VIN range Go
  • Changed Applications list items Go
  • Deleted Power Dissipation Ratings table Go
  • Changed y-axis unit measurement from ILIM to ICL for Figure 11Go
  • Changed Figure 31 and deleted layout silkscreen images; replaced with image of PCB layout drawing.Go
  • Changed title for Figure 31 Go
  • Changed title of Thermal Protection section Go

Changes from B Revision (December 2011) to C Revision

  • Deleted last Features bulletGo

Changes from A Revision (August 2011) to B Revision

  • Added last Features bulletGo
  • Changed last sentence of Description sectionGo
  • Added Mechanical Packages section (removed June 2013; packages are now automatically appended)Go
  • Added YFP to title of pin out drawingGo
  • Added YFP package to Thermal Information tableGo
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