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ZHCSG36D December 2016 – November 2017 TLV8541 , TLV8542 , TLV8544

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		TLV8544	TLV8542	TLV8541	UNIT
		PW (TSSOP)	D (SOIC)	DBV (SOT-23)
		14 PINS	8 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	124.5	141.6	244.6	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	52.7	85.7	127.3	°C/W
R_θJB	Junction-to-board thermal resistance	66.2	84.7	79.4	°C/W
ψ_JT	Junction-to-top characterization parameter	7.3	36.3	44.1	°C/W
ψ_JB	Junction-to-board characterization parameter	65.7	84.0	78.8	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.