ZHCSQR8A March   2023  – December 2023 TMAG5170D-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Magnetic Characteristics
    7. 5.7 Power up Timing
    8. 5.8 SPI Interface Timing
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensor Location
      3. 6.3.3 Magnetic Range Selection
      4. 6.3.4 Update Rate Settings
      5. 6.3.5 ALERT Function
        1. 6.3.5.1 Interrupt and Trigger Mode
        2. 6.3.5.2 Magnetic Switch Mode
      6. 6.3.6 Threshold Count
      7. 6.3.7 Diagnostics
        1. 6.3.7.1  Memory Cyclic Redundancy Check (CRC)
        2. 6.3.7.2  ALERT Integrity Check
        3. 6.3.7.3  VCC Check
        4. 6.3.7.4  Internal LDO Undervoltage Check
        5. 6.3.7.5  Digital Core Power-On Reset Check
        6. 6.3.7.6  SDO Output Check
        7. 6.3.7.7  Communication Cyclic Redundancy Check (CRC)
        8. 6.3.7.8  Oscillator Integrity Check
        9. 6.3.7.9  Magnetic Field Threshold Check
        10. 6.3.7.10 Temperature Alert Check
        11. 6.3.7.11 Analog Front-End (AFE) Check
        12. 6.3.7.12 Hall Resistance and Switch Matrix Check
        13. 6.3.7.13 Hall Offset Check
        14. 6.3.7.14 ADC Check
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operating Modes
        1. 6.4.1.1 Active Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Configuration Mode (DEFAULT)
        4. 6.4.1.4 Sleep Mode
        5. 6.4.1.5 Wake-Up and Sleep Mode
        6. 6.4.1.6 Deep-Sleep Mode
    5. 6.5 Programming
      1. 6.5.1 Data Definition
        1. 6.5.1.1 Magnetic Sensor Data
        2. 6.5.1.2 Temperature Sensor Data
        3. 6.5.1.3 Magnetic Sensor Offset Correction
        4. 6.5.1.4 Angle and Magnitude Data Definition
      2. 6.5.2 Serial Peripheral Interface (SPI)
        1. 6.5.2.1 SCK
        2. 6.5.2.2 CS
        3. 6.5.2.3 SDI
        4. 6.5.2.4 SDO
          1. 6.5.2.4.1 Regular 32-Bit SDO Read
          2. 6.5.2.4.2 Special 32-Bit SDO Read
        5. 6.5.2.5 SPI CRC
        6. 6.5.2.6 SPI Frame
          1. 6.5.2.6.1 32-Bit Read Frame
          2. 6.5.2.6.2 32-Bit Write Frame
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Selecting the Sensitivity Option
      2. 7.1.2 Temperature Compensation for Magnets
      3. 7.1.3 Sensor Conversion
        1. 7.1.3.1 Continuous Conversion
        2. 7.1.3.2 Trigger Conversion
        3. 7.1.3.3 Pseudo-Simultaneous Sampling
      4. 7.1.4 Error Calculation During Linear Measurement
      5. 7.1.5 Error Calculation During Angular Measurement
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Gain Adjustment for Angle Measurement
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Register Map
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.8 SPI Interface Timing

Over TA = -40°C to 125°C range and VCC = 2.3 V to 5.5 V (unless otherwise noted); Typical specification are at TA = 25°C and VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SPI Interface
fSPI SPI clock (SCK) frequency CL = 25 pF
VCC = 2.3 V to 3.0 V		 8 MHz
fSPI SPI clock (SCK) frequency  CL = 25 pF
VCC = 3.0 V to 5.5 V		 10 MHz
twhigh High time: SCK logic high time duration 45 ns
twlow Low time: SCK logic low time duration 45 ns
tsu_cs CS setup time: Time delay between falling edge of CS and rising edge of SCK 45 ns
th_cs Hold time: Time between the falling edge of SCK and rising edge of CS 45 ns
tpd_soen Delay time: Time delay from falling edge of CS to data valid at SDO 45 ns
tpd_sodis Delay time: Time delay from rising edge of CS to SDO transition to high-impedance 55 ns
tsu_si SDI setup time: Setup time of SDI before the rising edge of SCK 25 ns
th_si Hold time: Time between the rising edge of SCK to SDI valid 25 ns
tpd_so Propagation delay from falling edge of SCK to SDO 45 ns
tw_cs SPI transfer inactive time (time between two transfers) during which CS must remain high. CL = 25 pF 100 ns
tspi_deep_sleep Setup time between CS going low and SCK start during deep sleep mode 150 320 µs
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |