The TMCS1133-Q1 is specified for a continuous current handling capability on the TMCS1133xEVM which uses 4oz copper planes. This current capability is fundamentally limited by the maximum device junction temperature and the thermal environment, primarily the PCB layout and design. To maximize current-handling capability and thermal stability of the device, take care with PCB layout and construction to optimize the thermal capability. Efforts to improve the thermal performance beyond the design and construction of the TMCS1133xEVM can result in increased continuous-current capability due to higher heat transfer to the ambient environment. Keys to improving thermal performance of the PCB include:

• Use large copper planes for both input current path and isolated power planes and signals.
• Use heavier copper PCB construction.
• Place thermal via farms around the isolated current input.
• Provide airflow across the surface of the PCB.