The isolated input current safe operating area (SOA) of the TMCS1133-Q1 is constrained by self-heating due to power dissipation in the input conductor. Depending upon the use case, the SOA is constrained by multiple conditions, including exceeding maximum junction temperature, Joule heating in the leadframe, or leadframe fusing under extremely high currents. These mechanisms depend greatly on input current amplitude and duration, along with ambient thermal conditions.

Current SOA strongly depends on the thermal environment and design of the system-level printed circuit board (PCB). Multiple thermal variables control the transfer of heat from the device to the surrounding environment, including air flow, ambient temperature, and PCB construction and design. All ratings are for a single TMCS1133-Q1 device mounted on the TMCS1133xEVM, or equivalent PCB design with no air flow under specified ambient temperature conditions. Device use profiles must satisfy continuous current conduction SOA capabilities for the thermal environment planned for system operation.