ZHCSAV1A April   2013  – September 2019 TMP108

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
      1. 6.6.1 Two-Wire Timing Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interface
      2. 7.3.2 Serial Bus Address
      3. 7.3.3 Bus Overview
      4. 7.3.4 Writing and Reading Operation
      5. 7.3.5 Slave Mode Operations
        1. 7.3.5.1 Slave Receiver Mode:
        2. 7.3.5.2 Slave Transmitter Mode:
      6. 7.3.6 SMBus Alert Function
      7. 7.3.7 General Call
      8. 7.3.8 High-Speed (Hs) Mode
      9. 7.3.9 Timeout Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (M1 = 0, M0 = 0)
      2. 7.4.2 One-Shot Mode (M1 = 0, M0 = 1)
      3. 7.4.3 Continuous Conversion Mode (M1 = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Hysteresis Control (HYS1 and HYS0)
        2. 7.5.3.2 Polarity (POL)
        3. 7.5.3.3 Thermostat Mode (TM)
        4. 7.5.3.4 Temperature Watchdog Flags (FL and FH)
        5. 7.5.3.5 Conversion Rate
      4. 7.5.4 High- and Low-Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.1 Application Information

The TMP108 is used to measure the temperature of the board location where the device is mounted. The programmable address options allow up to four locations on the board to be monitored with a single serial bus.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |