ZHCSAV1A April   2013  – September 2019 TMP108

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
      1. 6.6.1 Two-Wire Timing Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Interface
      2. 7.3.2 Serial Bus Address
      3. 7.3.3 Bus Overview
      4. 7.3.4 Writing and Reading Operation
      5. 7.3.5 Slave Mode Operations
        1. 7.3.5.1 Slave Receiver Mode:
        2. 7.3.5.2 Slave Transmitter Mode:
      6. 7.3.6 SMBus Alert Function
      7. 7.3.7 General Call
      8. 7.3.8 High-Speed (Hs) Mode
      9. 7.3.9 Timeout Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (M1 = 0, M0 = 0)
      2. 7.4.2 One-Shot Mode (M1 = 0, M0 = 1)
      3. 7.4.3 Continuous Conversion Mode (M1 = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Hysteresis Control (HYS1 and HYS0)
        2. 7.5.3.2 Polarity (POL)
        3. 7.5.3.3 Thermostat Mode (TM)
        4. 7.5.3.4 Temperature Watchdog Flags (FL and FH)
        5. 7.5.3.5 Conversion Rate
      4. 7.5.4 High- and Low-Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 支持资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.2.2 Detailed Design Procedure

The TMP108 devices must be placed in close proximity to the heat source that must be monitored, with a proper layout for good thermal coupling. This placement ensures that temperature changes are captured within the shortest possible time interval. To maintain accuracy in applications that require air or surface temperature measurement, take care to isolate the package and leads from PCB heat sources.

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