ZHCSH87B September   2017  – February 2020 TMP461-SP

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
    1.     简化框图
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
        1. 7.3.1.1 Standard Binary to Decimal Temperature Data Calculation Example
        2. 7.3.1.2 Standard Decimal to Binary Temperature Data Calculation Example
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Filtering
      5. 7.3.5 Sensor Fault
      6. 7.3.6 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 General-Call Reset
    6. 7.6 Register Map
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Registers
        3. 7.6.1.3  Status Register
        4. 7.6.1.4  Configuration Register
        5. 7.6.1.5  Conversion Rate Register
        6. 7.6.1.6  One-Shot Start Register
        7. 7.6.1.7  Channel Enable Register
        8. 7.6.1.8  Consecutive ALERT Register
        9. 7.6.1.9  η-Factor Correction Register
        10. 7.6.1.10 Remote Temperature Offset Register
        11. 7.6.1.11 Manufacturer Identification Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Radiation Environments
      1. 8.3.1 Single Event Latch-Up
      2. 8.3.2 Single Event Functional Interrupt
      3. 8.3.3 Single Event Upset
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1 Layout Guidelines

Remote temperature sensing on the TMP461-SP device measures very small voltages using very low currents; therefore, noise at the device inputs must be minimized. Most applications using the TMP461-SP have high digital content, with several clocks and logic-level transitions that create a noisy environment. Layout must adhere to the following guidelines:

  1. Place the TMP461-SP device as close to the remote junction sensor as possible.
  2. Route the D+ and D– traces next to each other and shield them from adjacent signals through the use of ground guard traces, as shown in Figure 20. If a multilayer PCB is used, bury these traces between the ground or V+ planes to shield them from extrinsic noise sources. 5-mil (0.127 mm) PCB traces are recommended.
  3. Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are used, make the same number and approximate locations of copper-to-solder connections in both the D+ and D– connections to cancel any thermocouple effects.
  4. Use a 0.1-μF local bypass capacitor directly between the V+ and GND of the TMP461-SP device. For optimum measurement performance, minimize filter capacitance between D+ and D– to 1000 pF or less. This capacitance includes any cable capacitance between the remote temperature sensor and the TMP461-SP device.
  5. If the connection between the remote temperature sensor and the TMP461-SP device is less than 8-in (20.32 cm) long, use a twisted-wire pair connection. For lengths greater than 8 in, use a twisted, shielded pair with the shield grounded as close to the TMP461-SP device as possible. Leave the remote sensor connection end of the shield wire open to avoid ground loops and 60-Hz pickup.
  6. Thoroughly clean and remove all flux residue in and around the pins of the TMP461-SP device to avoid temperature offset readings as a result of leakage paths between D+ and GND, or between D+ and V+.
TMP461-SP ai_pcb_cross-section_sbos722.gif
NOTE: Use a minimum of 5-mil (0.127 mm) traces with 5-mil spacing.
Figure 20. Suggested PCB Layer Cross-Section
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