ZHCSP65
May 2022
TMUX7219M
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Thermal Information
6.4
Recommended Operating Conditions
6.5
Source or Drain Continuous Current
6.6
±15 V Dual Supply: Electrical Characteristics
6.7
±15 V Dual Supply: Switching Characteristics
6.8
±20 V Dual Supply: Electrical Characteristics
6.9
±20 V Dual Supply: Switching Characteristics
6.10
44 V Single Supply: Electrical Characteristics
6.11
44 V Single Supply: Switching Characteristics
6.12
12 V Single Supply: Electrical Characteristics
6.13
12 V Single Supply: Switching Characteristics
6.14
Typical Characteristics
7
Parameter Measurement Information
7.1
On-Resistance
7.2
Off-Leakage Current
7.3
On-Leakage Current
7.4
Transition Time
7.5
tON(EN) and tOFF(EN)
7.6
Break-Before-Make
7.7
tON (VDD) Time
7.8
Propagation Delay
7.9
Charge Injection
7.10
Off Isolation
7.11
Crosstalk
7.12
Bandwidth
7.13
THD + Noise
7.14
Power Supply Rejection Ratio (PSRR)
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Bidirectional Operation
8.3.2
Rail-to-Rail Operation
8.3.3
1.8 V Logic Compatible Inputs
8.3.4
Integrated Pull-Up and Pull-Down Resistor on Logic Pins
8.3.5
Fail-Safe Logic
8.3.6
Latch-Up Immune
8.3.7
Ultra-Low Charge Injection
8.4
Device Functional Modes
8.5
Truth Tables
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Data Acquisition Calibration
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
支持资源
12.4
Trademarks
12.5
静电放电警告
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DGK|8
MPDS028E
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsp65_oa
12.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。米6体育平台手机版_好二三四 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。
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