ZHCSHB1B January   2018  – August 2018 TPA3220

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     简化原理图
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Audio Characteristics (BTL)
    7. 7.7 Audio Characteristics (PBTL)
    8. 7.8 Typical Characteristics, BTL Configuration, AD-mode
    9. 7.9 Typical Characteristics, PBTL Configuration, AD-mode
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Internal LDO
        1. 9.3.1.1 Input Configuration, Gain Setting And Master / Slave Operation
      2. 9.3.2 Gain Setting And Master / Slave Operation
      3. 9.3.3 AD-Mode and HEAD-Mode PWM Modulation
      4. 9.3.4 Oscillator
      5. 9.3.5 Input Impedance
      6. 9.3.6 Error Reporting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Powering Up
        1. 9.4.1.1 Startup Ramp Time
      2. 9.4.2 Powering Down
        1. 9.4.2.1 Power Down Ramp Time
      3. 9.4.3 Device Reset
      4. 9.4.4 Device Soft Mute
      5. 9.4.5 Device Protection System
        1. 9.4.5.1 Overload and Short Circuit Current Protection
        2. 9.4.5.2 Signal Clipping and Pulse Injector
        3. 9.4.5.3 DC Speaker Protection
        4. 9.4.5.4 Pin-to-Pin Short Circuit Protection (PPSC)
        5. 9.4.5.5 Overtemperature Protection OTW and OTE
        6. 9.4.5.6 Undervoltage Protection (UVP) and Power-on Reset (POR)
        7. 9.4.5.7 Fault Handling
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo BTL Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedures
          1. 10.2.1.2.1 Decoupling Capacitor Recommendations
          2. 10.2.1.2.2 PVDD Capacitor Recommendation
          3. 10.2.1.2.3 BST capacitors
          4. 10.2.1.2.4 PCB Material Recommendation
      2. 10.2.2 Typical Application, Differential (2N), AD-Mode PBTL (Outputs Paralleled before LC filter)
        1. 10.2.2.1 Design Requirements
      3. 10.2.3 Typical Application, Differential (2N), AD-Mode PBTL (Outputs Paralleled after LC filter)
        1. 10.2.3.1 Design Requirements
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
      1. 11.1.1 VDD Supply
      2. 11.1.2 AVDD and GVDD Supplies
      3. 11.1.3 PVDD Supply
      4. 11.1.4 BST Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
      1. 12.2.1 BTL Application Printed Circuit Board Layout Example
      2. 12.2.2 PBTL (Outputs Paralleled before LC filter) Application Printed Circuit Board Layout Example
      3. 12.2.3 PBTL (Outputs Paralleled after LC filter) Application Printed Circuit Board Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
    2. 13.2 接收文档更新通知
    3. 13.3 社区资源
    4. 13.4 商标
    5. 13.5 静电放电警告
    6. 13.6 术语表
  14. 14机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DDW|44
散热焊盘机械数据 (封装 | 引脚)
订购信息

Fault Handling

If a fault situation occurs while in operation, the device acts accordingly to the fault being a global or a channel fault. A global fault is a chip-wide fault situation and causes all PWM activity of the device to be shut down, and asserts FAULT low. A global fault is a latching fault and clearing FAULT and restarting operation requires resetting the device by toggling RESET. De-asserting RESET should never be allowed with excessive system temperature, so it is advised to monitor RESET with a system microcontroller and only release RESET (RESET high) if the OTW_CLIP signal is cleared (high). A channel fault results in shutdown of the PWM activity of the affected channel(s). Note that asserting RESET low forces the FAULT signal high, independent of faults being present.

Table 6. Error Reporting

Fault/Event Fault/Event Description Global or Channel Reporting Method Latched/Self Clearing Action needed to Clear Output FETs
PVDD_X UVP Voltage Fault Global FAULT pin Self Clearing Increase affected supply voltage HI-Z
AVDD UVP
POR (AVDD UVP) Power On Reset Global FAULT pin Self Clearing Allow AVDD to rise HI-Z
OTW Thermal Warning Global OTW pin Self Clearing Cool below OTW threshold Normal operation
OTE Thermal Shutdown Global FAULT pin Latched Toggle RESET HI-Z
OLP (CB3C>1.7 ms) OC Shutdown Channel FAULT pin Latched Toggle RESET HI-Z
CB3C OC Limiting Channel None Self Clearing Reduce signal level or remove short Flip state, cycle by cycle at fs/3
Stuck at Fault(1) No OSC_IO activity in Slave Mode Global None Self Clearing Resume OSC_IO activity HI-Z
Stuck at Fault occurs when input OSC_IO input signal frequency drops below minimum frequency given in the Electrical Characteristics table of this data sheet.