ZHCSC61B March   2014  – September 2020 TPS2556-Q1 , TPS2557-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Terminal Configuration and Functions
    1.     Terminal Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
      1.      16
  8. 8 Parameter Measurement Information
    1.     18
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Overcurrent Conditions
      2. 9.3.2 FAULT Response
      3. 9.3.3 Thermal Sense
    4. 9.4 Device Functional Modes
      1. 9.4.1 Undervoltage Lockout (UVLO)
      2. 9.4.2 Enable ( EN OR EN)
      3. 9.4.3 Auto-Retry Functionality
      4. 9.4.4 Two-Level Current-Limit Circuit
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application, Design for Current Limit
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Determine Design Parameters
        2. 10.2.2.2 Programming the Current-Limit Threshold
        3. 10.2.2.3 Selecting Current-Limit Resistor 1
        4. 10.2.2.4 Selecting Current-Limit Resistor 2
        5. 10.2.2.5 Accounting for Resistor Tolerance
        6. 10.2.2.6 Power Dissipation and Junction Temperature
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1.     44
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)TPS2556-Q1, TPS2557-Q1UNIT
DRB
8 TERMINALS
RθJAJunction-to-ambient thermal resistance41.5°C/W
RθJC(top)Junction-to-case (top) thermal resistance56°C/W
RθJBJunction-to-board thermal resistance16.4°C/W
ψJTJunction-to-top characterization parameter0.7°C/W
ψJBJunction-to-board characterization parameter16.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance3.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).
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