ZHCSF57 June   2016 TPS51200-EP

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Sink and Source Regulator (VO Pin)
      2. 7.3.2  Reference Input (REFIN Pin)
      3. 7.3.3  Reference Output (REFOUT Pin)
      4. 7.3.4  Soft-Start Sequencing
      5. 7.3.5  Enable Control (EN Pin)
      6. 7.3.6  Powergood Function (PGOOD Pin)
      7. 7.3.7  Current Protection (VO Pin)
      8. 7.3.8  UVLO Protection (VIN Pin)
      9. 7.3.9  Thermal Shutdown
      10. 7.3.10 Tracking Start-up and Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low-Input Voltage Applications
      2. 7.4.2 S3 and Pseudo-S5 Support
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical VTT DIMM Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Voltage Capacitor
        2. 8.2.2.2 VLDO Input Capacitor
        3. 8.2.2.3 Output Capacitor
        4. 8.2.2.4 Output Tolerance Consideration for VTT DIMM Applications
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 3.3-VIN, DDR2 Configuration
      2. 8.3.2 2.5-VIN, DDR3 Configuration
      3. 8.3.3 3.3-VIN, LP DDR3 or DDR4 Configuration
      4. 8.3.4 3.3-VIN, DDR3 Tracking Configuration
      5. 8.3.5 3.3-VIN, LDO Configuration
      6. 8.3.6 3.3-VIN, DDR3 Configuration with LFP
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Design Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 开发支持
        1. 11.1.2.1 评估模块
        2. 11.1.2.2 Spice 模型
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

DRC Package
10-Pin VSON With Exposed Thermal Pad
Top View
TPS51200-EP drc_10_slus812.gif

Pin Functions

PIN I/O(2) DESCRIPTION
NAME NO.
EN 7 I For DDR VTT application, connect EN to SLP_S3. For any other application, use the EN pin as the ON/OFF function.
GND 8 G Signal ground. Connect to negative terminal of the output capacitor.
PGND(1) 4 G Power ground output for the LDO.
PGOOD 9 O PGOOD output. Indicates regulation.
REFIN 1 I Reference input.
REFOUT 6 O Reference output. Connect to GND through 0.1-μF ceramic capacitor.
VIN 10 I 2.5-V or 3.3-V power supply. A ceramic decoupling capacitor with a value between 1-μF and 4.7-μF is required.
VLDOIN 2 I Supply voltage for the LDO.
VO 3 O Power output for the LDO.
VOSNS 5 I Voltage sense input for the LDO. Connect to positive terminal of the output capacitor or the load.
(1) Thermal pad connection. See Figure 31 in the Thermal Design Considerations section for additional information.
(2) I = Input, O = Output, G = Ground.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |