SLUS851D October   2008  – October 2014 TPS54231

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency PWM Control
      2. 8.3.2  Voltage Reference (Vref)
      3. 8.3.3  Bootstrap Voltage (BOOT)
      4. 8.3.4  Enable and Adjustable Input Undervoltage Lockout (VIN UVLO)
      5. 8.3.5  Programmable Slow Start Using SS Pin
      6. 8.3.6  Error Amplifier
      7. 8.3.7  Slope Compensation
      8. 8.3.8  Current-Mode Compensation Design
      9. 8.3.9  Overcurrent Protection and Frequency Shift
      10. 8.3.10 Overvoltage Transient Protection
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Eco-mode™
      2. 8.4.2 Operation With VIN < 3.5 V
      3. 8.4.3 Operation With EN Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Switching Frequency
        2. 9.2.2.2 Output Voltage Set Point
        3. 9.2.2.3 Input Capacitors
        4. 9.2.2.4 Output Filter Components
          1. 9.2.2.4.1 Inductor Selection
          2. 9.2.2.4.2 Capacitor Selection
        5. 9.2.2.5 Compensation Components
        6. 9.2.2.6 Bootstrap Capacitor
        7. 9.2.2.7 Catch Diode
        8. 9.2.2.8 Output Voltage Limitations
        9. 9.2.2.9 Power Dissipation Estimate
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Estimated Circuit Area
    4. 11.4 Electromagnetic Interference (EMI) Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Revision History

Changes from C Revision (July 2012) to D Revision

  • Added Handling Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go

Changes from B Revision (February 2012) to C Revision

  • Added 5.3 to the MAX column of the ELEC CHAR table, section CURRENT LIMITGo
  • Deleted Maximum Power Dissipation versus Junction Temperature graphGo

Changes from A Revision (March 2010) to B Revision

  • Deleted Features Item: For SWIFT™ Documentation, See the TI Website at http://www.ti.com/swiftGo

Changes from * Revision (October 2008) to A Revision

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