ZHCSBD3D July   2013  – August 2019 TPS63050 , TPS63051

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图 (WCSP)
      2.      效率与输出电流间的关系
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Power Good
      2. 8.3.2 Overvoltage Protection
      3. 8.3.3 Undervoltage Lockout (UVLO)
      4. 8.3.4 Thermal Shutdown
      5. 8.3.5 Soft Start
      6. 8.3.6 Short Circuit Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Control Loop Description
      2. 8.4.2 Power Save Mode Operation
      3. 8.4.3 Adjustable Current Limit
      4. 8.4.4 Device Enable
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Output Filter Design
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Capacitor selection
          1. 9.2.2.4.1 Input Capacitor
          2. 9.2.2.4.2 Output Capacitor
        5. 9.2.2.5 Setting the Output Voltage
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example (WCSP)
    3. 11.3 Layout Example (HotRod)
    4. 11.4 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 使用 WEBENCH® 工具创建定制设计
    2. 12.2 器件支持
      1. 12.2.1 第三方米6体育平台手机版_好二三四免责声明
    3. 12.3 相关链接
    4. 12.4 接收文档更新通知
    5. 12.5 社区资源
    6. 12.6 商标
    7. 12.7 静电放电警告
    8. 12.8 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from C Revision (July 2015) to D Revision

  • 在数据表中添加了 Webench 链接Go
  • Changed the Pin ConfigurationsGo
  • Changed the quiescent current VIN max value From: 60 µA To: 65 µA in the Electrical CharacteristicsGo
  • Added Note: Conditions: TJ = –40°C to 85°C To the quiescent current and shutdown current in the Electrical CharacteristicsGo

Changes from B Revision (April 2015) to C Revision

  • Added 新封装选项至 项目符号Go
  • Added VQFN 封装至器件信息表Go
  • Added HotRod Pin Configuration and Functions Go
  • Added Parameter Measurement Circuit for HotRod package optionGo

Changes from A Revision (February 2014) to B Revision

  • Changed 说明 部分的第四段 Go
  • Changed 图形图像 Go
  • Changed Ordering Information table To:Device Comparison TableGo
  • Changed "Handling Ratings" table to "ESD Rating" table and moved Tstg spec to the Absolute Maximum Ratings tableGo
  • Moved some Typical Characteristics graphs to the Application Curves section Go

Changes from * Revision (July 2013) to A Revision

  • Added 器件信息表，ESD 额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go
  • Added TPS63050 器件规范和 说明 至整篇数据手册Go
  • Changed Figure 34, PCB Layout Go
  • Changed Figure 35, PCB Layout Go
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