SBVS080J September   2006  – November 2016 TPS75100 , TPS75103 , TPS75105

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Load Regulation
      2. 7.3.2 Line Regulation
    4. 7.4 Device Functional Modes
      1. 7.4.1 LED ON
      2. 7.4.2 LED OFF
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Setting the Output Current Level
      2. 8.1.2 Limitations on LED Forward Voltages
      3. 8.1.3 Use of External Capacitors
      4. 8.1.4 Use of Unused Outputs or Tying Outputs Together
      5. 8.1.5 Use of Enable Pins for PWM Dimming
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DSK|10
  • YFF|9
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from I Revision (November 2013) to J Revision

  • Added Device Information table, Typical Application Diagram title to front-page diagram, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed SON to WSON throughout document Go
  • Deleted pin out drawings from Typical Application Diagram figureGo
  • Changed I/O status to I from O in D1B row of Pin Functions table Go
  • Deleted Dissipation Ratings tableGo

Changes from H Revision (January 2010) to I Revision

  • Changed test conditions for ground current parameter in the Electrical CharacteristicsGo
  • Deleted Figure 14; duplicate mechanical image.Go

Changes from G Revision (March 2009) to H Revision

  • Revised ground current parameter, Electrical Characteristics; changed symbol from IQ to IGND; added specifications for YFF and DSK packagesGo
  • Added YFF and DSK package specifications for current matching parameter, Electrical CharacteristicsGo
  • Changed diode current accuracy parameter, Electrical Characteristics, to reflect YFF and DSK package specificationsGo
  • Deleted operating junction temperature range specification from Electrical Characteristics table to eliminate redundancyGo
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