米6体育平台手机版

ZHCSDL6C November 2014 – March 2019 TS3DDR4000

PRODUCTION DATA.

1 特性
2 应用
3 说明
1. Device Images
  1. 应用图
4 修订历史记录
5 Pin Configuration and Functions
1. Pin Functions
6 Specifications
7 Parameter Measurement Information
8 Detailed Description
9 Application and Implementation
1. 9.1 Application Information
2. 9.2 Typical Application
  1. 9.2.1 Non-Volatile Dual In-line Memory Module (NVDIMM) application
    1. 9.2.1.1 Design Requirements
    2. 9.2.1.2 Detailed Design Procedure
  2. 9.2.2 Load Isolation Application
    1. 9.2.2.1 Design Requirements
    2. 9.2.2.2 Detailed Design Procedure
10Power Supply Recommendations
11Layout
1. 11.1 Layout Guidelines
2. 11.2 Layout Example
12器件和文档支持
13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)

ZBA|48
- MPBGAJ5

散热焊盘机械数据 (封装 | 引脚)

订购信息

zhcsdl6c_oa
zhcsdl6c_pm

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.