ZHCSX92G December   2008  – October 2024 TS3USB30E

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Dynamic Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from Revision F (August 2015) to Revision G (October 2024)

  • Changed the Pin Configuration images and removed the RSW bottom view pinoutGo
  • Removed footnote in Absolute Maximum Ratings which stated "The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed."Go
  • Changed XTALK from -54dB to -32dB.Go
  • Changed OISO from -40dB to -32dBGo
  • Changed BW from 900MHz to 1400GHz and removed CL = 5pF from Test Conditions.Go
  • Changed the Gain vs Frequency graphGo
  • Changed the Crosstalk (XTALK) graphGo
  • Changed the Off Isolation (OISO) graphGo
  • Removed the 50Ω pulldown resistor on VOUT1 from the Off Isolation (OISO) imageGo
  • Added the text D next to VIN the Crosstalk (XTALK) imageGo

Changes from Revision E (August 2012) to Revision F (August 2015)

  • 添加了引脚配置和功能 部分、ESD 等级 表、特性说明 部分、器件功能模式应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
  • 说明 中的封装类型从DGS 更改为VSSOPGo