ZHCSC00C December   2013  – September 2024 UCC27532-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. 说明(续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VDD Undervoltage Lockout
      2. 7.3.2 Input Stage
      3. 7.3.3 Enable Function
      4. 7.3.4 Output Stage
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Driving IGBT Without Negative Bias
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Input-to-Output Configuration
          2. 8.2.1.2.2 Input Threshold Type
          3. 8.2.1.2.3 VDD Bias Supply Voltage
          4. 8.2.1.2.4 Peak Source and Sink Currents
          5. 8.2.1.2.5 Enable and Disable Function
          6. 8.2.1.2.6 Propagation Delay
          7. 8.2.1.2.7 Power Dissipation
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Driving IGBT With 13-V Negative Turnoff Bias
      3. 8.2.3 Using UCC27532-Q1 Drivers in an Inverter
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
  12. 11Device and Documentation Support
    1. 11.1 第三方米6体育平台手机版_好二三四免责声明
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 静电放电警告
    7. 11.7 术语表
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

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订购信息

Layout Guidelines

Proper PCB layout is extremely important in a high-current fast-switching circuit to provide appropriate device operation and design robustness. The UCC27532-Q1 gate driver incorporates short propagation delays and powerful output stages capable of delivering large current peaks with very fast rise and fall times at the gate of power switch to facilitate voltage transitions very quickly. At higher VDD voltages, the peak current capability is even higher (2.5-A and 5-A peak current is at VDD = 18 V). Very high di/dt can cause unacceptable ringing if the trace lengths and impedances are not well controlled. TI strongly recommends adhering to the following circuit layout guidelines when designing with these high-speed drivers.

  • Locate the driver device as close as possible to the power device to minimize the length of high-current traces between the driver output pins and the gate of the power-switch device.
  • Locate the VDD bypass capacitors between VDD and GND as close as possible to the driver with minimal trace length to improve the noise filtering. These capacitors support high peak current being drawn from VDD during turnon of power switch. TI highly recommends using low-inductance SMD components such as chip resistors and chip capacitors.
  • The turnon and turnoff current-loop paths (driver device, power switch, and VDD bypass capacitor) must be minimized as much as possible to keep the stray inductance to a minimum. High di/dt is established in these loops at two instances — during turnon and turnoff transients — which induces significant voltage transients on the output pins of the driver device and gate of the power switch.
  • Wherever possible, parallel the source and return traces of a current loop which takes advantage of flux cancellation
  • Separate power traces and signal traces, such as output and input signals.
  • Star-point grounding is a good way to minimize noise coupling from one current loop to another. The GND of the driver must be connected to the other circuit nodes such as source of power switch, ground of PWM controller, and others at one, single point. The connected paths must be as short as possible to reduce inductance and be as wide as possible to reduce resistance.
  • Use a ground plane to provide noise shielding. Fast rise and fall times at OUT can corrupt the input signals during transition. The ground plane must not be a conduction path for any current loop. Instead the ground plane must be connected to the star-point with one single trace to establish the ground potential. In addition to noise shielding, the ground plane can help in power dissipation as well.