over operating free-air temperature range (unless otherwise noted)(1)(2)(3) | MIN | MAX | UNIT |
|---|
| Supply voltage, VDD | –0.3 | 30 | V |
| Output Voltage, OUTA, OUTB | DC | –0.3 | VDD +0.3 | V |
| 200ns Pulse | –2 | VDD +3 | V |
| Input Voltage INA, INB, ENA, ENB | –10 | 30 | V |
| Operating junction temperature, TJ | –40 | 150 | °C |
| Lead temperature | Soldering, 10 sec. | | 300 | °C |
| Reflow | | 260 |
| Storage temperature, Tstg | –65 | 150 | °C |
(1) Operation outside the Absolute Maximum Ratings
may cause permanent device damage. Absolute
Maximum Ratings do not imply functional operation
of the device at these or any other conditions
beyond those listed under Recommended Operating
Conditions. If outside the Recommended Operating
Conditions but within the Absolute Maximum
Ratings, the device may not be fully functional,
and this may affect device reliability,
functionality, performance, and shorten the device
lifetime.
(2) All voltages are with respect to GND unless
otherwise noted. Currents are positive into,
negative out of the specified terminal. See
GUID-046951F8-5725-42A3-AE1D-053A3A9DD24A.html
of the datasheet for thermal limitations and
considerations of packages.
(3) These devices are sensitive to electrostatic
discharge; follow proper device handling
procedures.